We are working to enable deeper, more impactful collaborations across the semiconductor supply chain with the Athinia ecosystem, powered by Palantir's leading security, data integration and analytics platform and Merck KGaA's industry expertise. Leading business development for semiconductor industry suppliers is a multi-faceted role.Digital Intrapreneur - leveraging internally developed and proven data management and analytics offerings to build an external, revenue-generating business under the entrepreneurial EMD Digital business Business Development - built a customer pipeline from zero to a value of several $MMs of AAR in the first year of operation. Created value propositions and positioning for our highly secure data collaboration platform for several segments of the value chain.Product Management - let the development of a suite of low-/no-code data analytics tools, including correlation, regression, classification and visualization modules, built on top of Palantir Foundry. Successfully pitched project based on customer VOC and managed resourcing and staff. Increased consumption revenue with these user-friendly tools.Solution Architecture - led successful completion of customer implementation projects by creating the technical vision and roadmaps to meet specific customer needs during early adoption phases.

Helping biotechnology innovators accelerate their next most critical development and pre-clinical deliverables by developing informatics products that allow biologists and bioinformaticians to get right to high value insights from their multi-omics data.

Positioning AspenTech Performance Engineering as the go-to solution for achieving sustainability commitments, overcoming operational limitations and and reaching net zero faster in the process industriesGrowing pipeline by enabling sales to communicate the power of Industrial AI in process simulation - making models approach process reality through machine learning driven calibrationAmplifying customer success by leading the Performance Engineering Product Marketing team

Leading Product Management at Semiconductor Lithography Technologies business in DuPont E&IBuilt greater than $100MM annualized growth portfolio for semiconductor lithography materials businessRebuilt business planning process to ensure resilience in face of multiple market disruptionsLed multiple market studies of potential Internet-of-Things products and business models for DuPont E&I growth team

Launched two growth projects in semiconductor sensor materials in collaboration with corporate growth technologies groupRe-positioned 193nm resist business to grow by 20% by promoting select new products and prioritizing R&D efforts to tackle key challenges in self-aligned multi-patterning techniquesCommercialized two new products for growth in both memory and logic spaces

Designed new materials for Quantum Dot down conversion systems for display applications. Co-inventor on multiple patent applications for QD resin designs. Led tech transfer from internal R&D and external technology partner to Manufacturing facilities in Korea. Earned Six Sigma Green Belt Project Leader certification.Technical lead for next-generation lithography materials development projects at the SUNY Poly CNSE facility for 2 years. Negotiated wafer processing agreements, collaborated with customers and technology partners of 20nm and 14nm processes. Demonstrated first Directed Self Assembly patterning on 450mm wafers. Co-inventor on multiple patent applications for self-aligned patterning techniques.

Part of start-up team for Fab 8 Manufacturing Engineering, with one-year expat assignment in Dresden, GermanyEnsured on-time startup of Lithography Department to meet accelerated fab startup schedule by building complete project plan for all equipment installs and process stepsSuccessfully transferred 32nm, 28nm and 20nm lithography processes and materials from multiple mother fabsCreated operating budgets and supply plans for all lithography materials used in fab

Led three department-level projects to completion, with all milestones reachedDeveloped die-to-die and die-to-wafer unit processes and studied advanced bonding and interconnect materials for 3D Interconnect Integration at SEMATECH as an assignee from HPAuthored and tech transfer documents and presented at quarterly advisory group meetings to keep member companies informed

Qualified new materials and processes for flexible electronics and MEMS devices using fundamentals of Project Management and Design of Experiments.Accepted opportunity to take two year assignment to the SEMATECH 3D Interconnect program in Albany, NY.