• Productivity & yield improvement: fleet/chamber matching, FDC correaltion to process & defect performance, and process margin improvement & variability reduction for high volume semiconductor & display manufacturing fabs• Development of fab tool management services for yield enhancement & system productivity/quality improvement

- Consultation on BEOL Process Integration and Technology for Advanced Logic IC Foundries (14nm/20nm)(1) Yield impact analysis and technology consulting on process integration and module processes for logic/SRAM devices(2) Evaluation/qualification of BEOL module processes and processing equipments(3) Analyses of defectivity/systematic risks & yield trending, commonality, failed TEG’s, defect ovelay, process risk/ misalignment/margin/window check, etc.(4) Design of test chips for 14nm/20nm logic process integration & process development incl. design rule validation

- Research and Consultation on Materials System and Process Technology for Semiconductor and Renewable Energy Applications(1) Novel materials and fabrication process technology research(2) Market and technology analysis

- Applications, Materials, Fabrication Process, Product Development for Advanced Solar Applications: (1) Technology/market research and product/project management for manufacturing of advanced solar products (i) Technology/market analysis and product/project planing for advanced solar cells/modules and fabrication tools (ii) Product development and marketing planing/management incl. engineering tesitng and supplier development (2) Design, Fabrication & process integration of advanced solar cells by CVD, PVD, printing and diffusion processes (i) Development of TCO, diffusion barrier and adhesion/seed materials and process technologies for improved performance in thin film Si and advanced Si c-Si solar cells incl. ABC, HJ and PERL cells (ii) Design and development of cost effective & novel materials and fabrication processes for selective emitter, advanced surface field/ passivation, metallization & patterning applications by diffusion, SP, inkjet, CVD, PVD & laser processes (iii) Development and evaluation of novel dopant sources deposited by screen/inkjet printing and CVD processes, and diffusion process using furnace, RTP & laser tools for selective emitter and advanced surface field applications

- Product Development, Management and Marketing of SiP and IPD Products for RF/Wireless Device and Advanced IC Pacakging Applications: (1) Market analysis/development, cost modeling and product planing incl. supply chain develoment for manufacturing (2) Fabrication process development, device integration for IPD’s: Process flow, process development and integration incl. PVD (Al, Ti/TiN, TaN, Cu, NiV), PECVD (USG, SiN), metal/dielectric Etch, Cu plating processes for fabrication of integrated passive components., e.g., thin film resistor (TaN), capacitor (SiN/Al), inductor (Cu) (3) High Q/ low loss substrate materials development (Glass, HR Si, SiC composite) for IPD application for RF wireless device

(1) Development and Integration of Products/ Process/ Applications/Materials for Semiconductor Manufacturing Equipment: –Endura metallization system/process/applications development for advanced memory and logic devices: (i) ALPS: Al, Ti & Co/Ni deposition chambers for liner/barrier for Al/W/Cu interconnect & Co/Ni silicide applications (ii) SIP and IMP: Ti/TiN chamber for liner/barrier, capping layer & metal contact, metal gate & capacitor applications (iii) Std-TTN & Al: Ti/TiN & Al deposition chambers for Al/Cu liner/barrier, ARC, UBM, Al bondpad & hardmask layers–Process develoment/integration of interconnect schemes for Al/W/Cu metallization incl. diffusion barrier/liner/capping layers and front end applications incl. metal gate and silicide layers for advanced logic and memory devices(2) Product/ Project Management for Semiconductor Processing Equipments: –Management and volume release of metallization products incl. applications/materials/process/supplier development & evaluation, customer demo, CIP activities, manufacturing transfer, product training & support as a technology manager(3) Customer Interface and Support: –Product introduction, customer demos, JDP, training & field support on Al/W/Cu metallization system & applications incl. process development/optimization/integration, device qualification, film & defect characterization, and trouble shooting

- Conducted Research on Thin Film and Plasma Materials Processing Techniques(1) SiC based thin film temperature sensors by plasma assisted evaporation and reactive sputtering processes.(2) MoSi2 and Pt/PtRh thin film temperature sensors on ceramic turbine blades (SiC, SiN) by reactive sputtering process(3) Developed Al2O3 and SiO2 protective coatings for thin film sensors by plasma assisted e-beam evaporation process(4) a-Si and a-C films as adhesion layers for SiC film growth by e-beam evaporation and PECVD processes