Sr. Technology Manager, New Product And New Business Development
- Product Development, Management and Marketing of SiP and IPD Products for RF/Wireless Device and Advanced IC Pacakging Applications: (1) Market analysis/development, cost modeling and product planing incl. supply chain develoment for manufacturing (2) Fabrication process development, device integration for IPD’s: Process flow, process development and integration incl. PVD (Al, Ti/TiN, TaN, Cu, NiV), PECVD (USG, SiN), metal/dielectric Etch, Cu plating processes for fabrication of integrated passive components., e.g., thin film resistor (TaN), capacitor (SiN/Al), inductor (Cu) (3) High Q/ low loss substrate materials development (Glass, HR Si, SiC composite) for IPD application for RF wireless device