Chris Horng Email & Phone Number

Espoo, Southern Finland, FI

Mountain View, California, US

• Drove packaging process development in multiple electrical and photonic architectures
• Analyzed packaging process data and wafer yield data with wafer map visualization
• Established data pipeline for wafer test data with data automation
• Drove cross-functional team collaboration for chip and system level design requirements
• Led product competitive analysis in specification and cost structure with CTO
• Contributed to chip tape-out test structures for both advanced electrical and photonic technology development

San Jose, CA, US

• Developed and qualified 2.5D & 3D packaging architectures (CoW, FOWLP) with processes (UBM, RIE, CoW, backgrinding, wirebonding, fan-out process, molding, BGA, wafer dicing) with OSAT
• Failure analysis: Driving packaging failures with SEM, TEM/FIB, X-Ray, TOF-SIMS
• Substrate design: Familiar with AutoCAD and Gerber reviewer for DFM assessment and implementing test structures
• Mechanical modeling: Generated 3D model with Solidwork and analyzed thermal and mechanical risks

San Jose, CA, US

• Developed reliability plans and qualified packages optical modules with Weibull analysis
• Audited supplier manufacturing site and led supplier quarter reviews
• Managed product lifecycle with internal PLM tools

Boise, Idaho, US

• Analyzed product quality using advanced imaging techniques and data visualization tool, such as Matplotlib. Successfully improved product yield by 20% through my data-driven insights and recommendations
• Developed new process specifications enhancing 3D package product assembly reliability

La Jolla, CA, US

• Developed ultra-sound imaging device and software, and visualized muscle structure from measured ultrasound data➢ Microfabricated flexible sensors, photodiodes in cleanroom with photolithography instruments➢ Material.

Hsinchu, Taiwan, TW

• Reduced processing time by 15%, and cost by 10% with design data analysis software, Calibre Mask Software
• Translated client needs into internal technical specifications for photomask design

Champaign, IL, US

• Rogers Research Group UIUCUndergraduate research at Materials Research Laboratory
• Designed devices for optoelectronic applications in photovoltaics and photodetection ➢Fabricated photodiode in cleanroom with photolithography instruments: E-Beam Evaporator,Photolithography Reactive Ion Etching, Mask.
• Developed Bio-compatible Substrates for implanting optogenetic electronic devices ➢Utilized photolithography technologies to fabricate RF energy harvested neuron stimulator
• Fabricated stretchable circuits and transferred silicon pattern from one substrate to the samples

Taipei, Northern Taiwan, TW

• Developed and Fabricated integrated microfluidic devices
• Testing and analyzed blood cell count sensor with Python
• Utilized AutoCAD to design proper flow channel for mixing chemical solution and human blood

Taoyuan, TW, TW

• Conducted product marketing analysis reporting to Marketing VP with survey through public events and social media
• Collected informative data from various customer through public events and social media
• Designed and executed public events to promote products with potential customers

• Participated in testing and diagnosing computers problems
• Repaired laptops and desktops problems in both hardware and software

US

• Participated in final assembly works for HP notebook product,
• Supervised manufacturing and production lines
• Assisted on warehouse management and material kitting preparation

Bootcamp, Data Science

Master Of Science (Ms), Materials Science & Engineering

Bachelor'S Degree, Materials Science