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Retired innovation-focused technology leader with broad experience in mixed-signal integrated circuit development, biometric fingerprint sensors, electronic packaging, smart card manufacturing, active-matrix (TFT) display systems and display-integrated capacitive touch sensing systems. I've enjoyed working closely with customers and technology partners to build strong joint-development partnerships and product roadmaps.
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Svp, Silicon And Sensor TechnologiesIdex Biometrics Mar 2019 - Nov 2022Rochester, New York AreaResponsible for IDEX’s Silicon Engineering, Product-Test Engineering and Sensor Technologies organizations. Sensor Technologies is an umbrella organization encompassing Sensor Development, Display Integration, Sensor Packaging, and Smart Card Manufacturing functions.Silicon team developed a 3rd-generation biometric controller in 40nm E-FLASH process. This is a mixed-signal device with ARM Cortex-M3 Core plus peripherals, analog and digital signal processing chain, and energy harvesting/power management feature set with industry dominating performance and first-iteration silicon success.The Sensor Substate and Packaging teams developed a roadmap of fingerprint sensors that combine semiconductor and display packaging technologies with the custom ASIC to create industry-leading biometric sensors with large area and low-cost relative to silicon sensors. Built Smart Card manufacturing capability to enable high-quality demonstration cards to showcase IDEX biometric payment card technology. This team is a multi-disciplined, smart card manufacturing organization with expertise in flex and embedded-wire inlay design, EMV Module design, card stack-up definition and milling/embedding processes to incorporate secure chips and biometric sensors into conventional payment cards. The team supports industry customers and partners by solving technology problems that limited biometrics adoption in high-volume, hot-laminated PVC and metal-core smart cards.Product/Test Engineering is responsible for silicon test and sensor test development, deployment and yield monitoring with outsourced assembly and test subcontractors. Both validation and production tests are developed on an in-house Teradyne UltraFLEX tester. -
Vice President, Silicon And Packaging EngineeringIdex Biometrics Jun 2016 - Mar 2019Rochester, New York AreaResponsible for Silicon Engineering, Product and Test Engineering, Display-Centric Technologies and Packaging Technology for IDEX's advanced fingerprint sensing devices. The silicon engineering organization is composed of teams focused on silicon and system architecture, analog/digital ASIC Design and Verification, and physical design. The Product & Test Engineering group is focused on silicon validation, characterization, qualification and silicon test development. This team is also responsible for product-level characterization, qualification, test development and sustaining engineering. The Display Technologies team is applying display backplane technology to advanced active sensor concepts and applying IDEX ASICs to control display technologies for disruptive biometric display card applications.The Packaging team is responsible for advanced package technologies for off-chip and display-centric fingerprint sensors. -
Sr. Director, Display Integration - Office Of The CtoAtmel Corporation Jul 2014 - Apr 2016Rochester, New York AreaInitially worked as a consultant and later as a direct employee to provide display and in-cell expertise along with customer-facing support to interact with handset, tablet and PC OEMs and Display Manufacturers (LCMs). Helped build the CTO Display Integration team with a focus on supporting in-cell touch and power-management architectures and longer-term goal to developed specialized display, touch and PMIC architectures for IoT markets. -
PresidentDisplay Research Associates, Inc. Jul 2014 - Jan 2016Rochester, New York AreaPrimary focus was consulting for Atmel - I was not a direct employee due to a hiring restriction that was later lifted. Display and In-cell Capacitive Touch strategic consulting to provide technical and market insights for the display driver (DDI, TDDI) and touch controller markets. Experience with self-capacitance, mutual-capacitance and hybrid sensing architectures with various display stack-ups such as Hybrid In-cell (C1T), Full In-cell, bars/stripes and matrix-type patterns.
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Sr. Director, Tddi Platform EngineeringSynaptics Feb 2009 - Jun 2014Rochester, New York AreaManaged Development of Touch and Display Driver ICs (TDDI) Products for In-cell and conventional touch/display solutions. Most recently responsible for advanced in-cell system and silicon architecture including sensor modeling, performance prediction and concept prototyping. Experience working with major LCMs on their display integration developments. -
Director, Mobile Display DriversNational Semiconductor Jan 2001 - Jan 2009Rochester, New York AreaFounded and built new product development center of 17-20 people for National to address the then-emerging mobile display market. Products developed with leading LCMs such as Sharp, TMD, Sanyo-Epson, Toppoly. Responsible for IC Design and Layout, Silicon Validation, Product/Test Engineering and Product Applications Engineering. Significant design wins achieved with major handset products such as Apple's revolutionary 1st generation iPhone and iPod Touch. -
Director, Ic DesignVivid Semiconductor Aug 1997 - Aug 2000Phoenix, Arizona AreaManaged IC Design and Layout functions for high-end notebook TFT LCD markets. Products included Source Drivers, Timing Controllers, Gamma References and high-speed point-point serial interfaces. -
Design ManagerCirrus Logic Jan 1993 - Aug 1997Austin, Texas AreaCrystal Semiconductor - Subsidiary of Cirrus Logic -
Senior Design EngineerEastman Kodak Jun 1980 - Dec 1992Rochester, New York Area
Christopher A Ludden Skills
Christopher A Ludden Education Details
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Electrical Engineering -
Electrical Engineering
Frequently Asked Questions about Christopher A Ludden
What is Christopher A Ludden's role at the current company?
Christopher A Ludden's current role is Retired. Thanks to employers and colleagues over the past 40 years for helping me get here!..
What is Christopher A Ludden's email address?
Christopher A Ludden's email address is ch****@****ics.com
What is Christopher A Ludden's direct phone number?
Christopher A Ludden's direct phone number is +158566*****
What schools did Christopher A Ludden attend?
Christopher A Ludden attended Rochester Institute Of Technology, Rochester Institute Of Technology.
What skills is Christopher A Ludden known for?
Christopher A Ludden has skills like Ic, Mixed Signal, Semiconductors, Cmos, Asic, Analog, Integrated Circuit Design, Soc, Power Management, Electronics, Engineering Management, Firmware.
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