Svp, Silicon And Sensor Technologies
Responsible for IDEX’s Silicon Engineering, Product-Test Engineering and Sensor Technologies organizations. Sensor Technologies is an umbrella organization encompassing Sensor Development, Display Integration, Sensor Packaging, and Smart Card Manufacturing functions.Silicon team developed a 3rd-generation biometric controller in 40nm E-FLASH process. This is a mixed-signal device with ARM Cortex-M3 Core plus peripherals, analog and digital signal processing chain, and energy harvesting/power management feature set with industry dominating performance and first-iteration silicon success.The Sensor Substate and Packaging teams developed a roadmap of fingerprint sensors that combine semiconductor and display packaging technologies with the custom ASIC to create industry-leading biometric sensors with large area and low-cost relative to silicon sensors. Built Smart Card manufacturing capability to enable high-quality demonstration cards to showcase IDEX biometric payment card technology. This team is a multi-disciplined, smart card manufacturing organization with expertise in flex and embedded-wire inlay design, EMV Module design, card stack-up definition and milling/embedding processes to incorporate secure chips and biometric sensors into conventional payment cards. The team supports industry customers and partners by solving technology problems that limited biometrics adoption in high-volume, hot-laminated PVC and metal-core smart cards.Product/Test Engineering is responsible for silicon test and sensor test development, deployment and yield monitoring with outsourced assembly and test subcontractors. Both validation and production tests are developed on an in-house Teradyne UltraFLEX tester.