• New product introduction and release to production for WLAN product lines.• AECQ100 qualification flow and procedures for QCOM’s automotive product lines.• Qualification hardware design, Burn-In boards, and bHAST boards design.• Statistical analysis of ATE characterization data over PVT using DataPower.• Spec validation and offshore release to production.• Worked with QA to resolve any qualification failures or customer returns.• Project management– Maintain and update qualification schedules for all pre-production products.

• New product introduction and release to production.• Generate qualification plans and run all product qualification. • Experienced in Burn-In board design, debug, and pattern conversion.• Statistical analysis of ATE characterization data over process,voltage and temperature.• Spec validation and offshore release to production.• Monitor production yields offshore and resolve any manufacturing or process issues.• Cost reduction activities, test time reduction, multi-site testing, and conversion of products to blind build.• Interface with design, process, and package engineers to resolve any qualification issues.• Test and resolve all issues with customer returns- ATE coverage, failure analysis, and system verification.• Interface with marketing, planning and design to ensure quality. pre-production customer samples are delivered on schedule.

• Responsible for test and debug of MAP1000A and MAP-CA media processors.• Built and maintained production test programs for MAP media processors on the HP83000.• Converted test vectors from simulation to HP83000 format.• Maintained production sort program on Advantest T6671.• Resolved production issues with wafer fab, test house, and assembly vendor.• Correlated system to tester yield and worked with internal teams to improve test coverage.

• Worked with design engineering to debug microprocessors, using e-beam prober, IMS tester, and Teradyne J973 tester.• Built, ordered and helped design all test hardware for MIPS R10000 microprocessors, load boards, probe cards, and interfaces for e-beam probing.• System characterization of MIPS microprocessors over frequency temperature, and voltage.• Setup and debug wafer sort issue on the Teradyne J973 and J971 VLSI testers.• Used Teradyne J973 and J971 software tools for data collection and pattern debug.• Responsible for new test equipment evaluation and installation.