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R&D Product Integration Engineer in Nanofabrication with over 20 years of experience in device fabrication process development and manufacturing in Hard Dish Drive, specializing in various commercial and prototype products such as magnetic recording heads and semiconductor devices. • Versatile technologist able to work effectively from the early stage of product R&D to integration and scaling up to manufacturing of a New Product Introduction (NPI) to Manufacturing for high-volume production. I am particularly passionate about new process challenges and excel at bringing together the right resources and expertise to complete a project on schedule. • Production Test Manager of the server CPU with experience growing my team from 4 people to 7, managing challenging, fluid schedules, planning, tracking, and optimizing test procedures, improving overall yield by 15%. • Four patents were granted in thin-film magnetic recording heads technology for computer hard disk drives.SKILLSIntegration skills: photo mask design, thin film deposition, dry etch process, metrology, inter-department collaboration, Work Stream for Material Tracking and management; Reflection X; JMP Statistical Software, PCB tester socket; MS Office Suite; Win SPC; Fab Time (cycle time management for wafer fab) Allegro, Agile and SAP. and Google doc—DVT thermal plunger setup for PVT. Set up hardware test bench, oscilloscope, DMM, signal generator, spectrum analyzer, oscilloscope, Keysight PNA, knowledge of RF components for broadband, RF - connectors, adapters, and cables. Board reworks and soldering.
Macom Technology Solution
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Design EngineerMacom Technology SolutionSan Jose, Ca, Us
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Principal Product EngineerMacom Technology Solution Jun 2019 - Present• Product Engineer for Optical Clock Revery test equipment and oversee the Pre-Production Operation.• Maintain Macom product OCR100G BOM and build documents in Agile for pre- and LVM Production release.Maintained daily support operations for all cross-functional Teams in the Lab.• Support board bring up and functional test for all programs (PAM4) • Provided hardware test setup and maintained all PVT temperature testing.• Support SerDes compliance tests for various programs.• Running and maintaining, the IP setup “High speed Analog-to-Digital Converter” and producing full characterization reports.• Maintain the IP setup for high-speed Phase Locked Loop and produce full characterization reports.• Bring-up characterization engineers when characterization phase begins.• Debugging high-speed bring-up, validation, and application boards for various programs. • Debug python scripts that are used to set up the IP(ADC/MZI-Driver/PLL’s and SerDes)• Provide logistics to all programs (transfer access, shipping, distribution, purchase requisitions, etc.)• Works with Vendor for RMA.• Maintain tracking Doc for board distribution and peripherals inventory. • Excellent organization, communication, and Team building skills.
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System Level Test Production ManagerApplied Micro Sep 2014 - Aug 2016Us• Took over a new team of four, grew it to 7 members, and organized and set up full test and maintenance infrastructure (manufacturing procedures, specs, training), making it fully automated and paperless, improving overall yield from 33% to 45% over one year.• Doubled number of chip units tested per quarter from 15K to 30K, by managing the Tester socket tester quality and production uptime to 100% and improving test process flows and socket maintenance procedures.• Improved overall yield by up to 20%, beat the delivery of goods from 3 to 5 days, and reduced socket maintenance cost by 50%.• Led production operation team on system level test CPU chip for server application, shipment schedule, monitoring and maintaining all test processes and operating procedures. Coordinated and supervised the Team’s schedule hours, assigning duties during testers’ downtime and time off and providing guidance to establish production goals to reflect changes in business with NPI. -
Principal R&D Product Integration EngineerWd, A Western Digital Company 2003 - 2012San Jose, Ca, Us• Introduce and implement new products to the Manufacturing Line.• Developed and integrated processes for 1-terabyte next-generation technology in HVM production. • Collaborate with NPI program, Design, and Development Engineering to qualify new products.• I evaluated the R&D product design for transfer to a 1-terabyte HDD to meet the product launch on time.• Create a new process route to upgrade existing processes/products.• Debugged and implemented new components into product prototypes with design specifications.• Worked with Process and Equipment Engineering to qualify new processes or equipment as main path or backup. • Worked with Failure Analysis and Yield teams to improve Line yield, wafer probe yield, and cycle time.• worked with the QA team to ensure spec, procedure, and outgoing product quality. • Worked with the backend process team to improve the performance of the product and back-end process yield.• Reduced development lots on hold and provided immediate disposition of wafers on hold.• Improved cycle time during the development phase by 10% and improved manufacturing by 20%. -
Senior R&D Process Integration EngineerRead Rite 1997 - 2003• Collaborated successfully within a cross-functional process development team to integrate a next-generation HDD technology and helped to transfer the volume production of new technologies to Production for high-volume manufacturing.• Co-developed new components and process techniques for silicon memory chips (MRAM) using the available toolset designed for magnetic recording technology.• Coordinated with vendors, sales representatives, and machine shops to devise solutions for using the available toolset to accommodate silicon wafers. Aided the process team toward a successful demonstration of MRAM process capability.• Integrated MRAM technology to manufacturing. Implemented design changes, approved new process procedures, set up process specifications, control limits, probe test parameters, and OCAPs.
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Senior Thin Film Process Sustaining EngineerPhilips Semiconductor 1992 - 1997I am a process-sustaining engineer for thin films, diffusion, metallization, and ion implants.• Worked with Manufacturing Technicians to support the disposition of wafers on hold of Thin Film metal deposition layers and Diffusion/Implant. • Supported Production and development activities to achieve the desired WIP turns and cycle time goals.• Coordinated with Maintenance to review daily tools priorities and qualification timelines.• Provided all manufacturing engineering support required for new technology transfers.
Christopher Ngo Skills
Christopher Ngo Education Details
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University Of OregonElectrical And Electronics Engineering
Frequently Asked Questions about Christopher Ngo
What company does Christopher Ngo work for?
Christopher Ngo works for Macom Technology Solution
What is Christopher Ngo's role at the current company?
Christopher Ngo's current role is Design Engineer.
What is Christopher Ngo's email address?
Christopher Ngo's email address is ch****@****wdc.com
What is Christopher Ngo's direct phone number?
Christopher Ngo's direct phone number is (408) 542*****
What schools did Christopher Ngo attend?
Christopher Ngo attended University Of Oregon.
What are some of Christopher Ngo's interests?
Christopher Ngo has interest in Scuba Diving, Photography And F1 Racing, Running, Mountain Biking, Human Rights, Photography And Motorsport.
What skills is Christopher Ngo known for?
Christopher Ngo has skills like Spc, Hardware, Design Of Experiments, Storage, Semiconductors, Manufacturing, R&d, Testing, Semiconductor Industry, Hard Drives, Strategic Planning, Product Management.
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