Christopher Prindle Email & Phone Number

Palo Alto, California, US

Scottsdale, Arizona, US

• Program manager simultaneously leading 45nm and 130nm RF technologies in high-volume manufacturing, generating millions in revenue for GF.
• Lead integrator solving product yield problems to improve customer satisfaction, and mitigating risks of process change qualifications before implementing in production.

Malta, NY, US

• Program manager simultaneously leading 45nm and 130nm RF technologies in high-volume manufacturing, generating millions in revenue for GF.
• Lead integrator solving product yield problems to improve customer satisfaction, and mitigating risks of process change qualifications before implementing in production

Malta, NY, US

• Junction module integration leader for 7nm and 3nm finFET technologies, engineering source/drain spacer and epitaxy process integration innovations to achieve transistor performance and yield milestones, and ultimately.
• MOL module integration leader for 3nm nanosheet gate-all-around transistor research, implementing contact patterning solutions to enable significantly improved transistor yield, and identifying critical sources of.

Malta, NY, US

• FEOL technology owner of 28nm product yield ramp-up, directing FEOL yield improvement and defect troubleshooting with a 20-person team, and meeting product requirements for a major customer.
• FEOL integrator spearheading polysilicon removal and embedded silicon germanium epitaxy module development, improving yield and reducing defectivity in 20nm technology.

Santa Clara, California, US

• MOL lead integrator for 45nm SOI technology development, enabling tech transfer of dual stress liner and contact modules to AMD Fab 36 in Dresden, Germany, culminating in production ramp of high-yielding 45nm SOI.
• Gate module integration leader for 22nm SOI technology development focused on high-k/metal gate and gate patterning, and managed several defect density reduction projects, which enabled solid fundamental understanding.

• BEOL integrator transferring CMOS 120nm copper/low-k technology from 200mm wafer factory to 300mm start-up factory, enabling first silicon yield, and employing extensive hands-on lot processing in the fabs.
• 120nm and 90nm BEOL process integration owner in high-volume 300mm manufacturing, performing parametric and yield analyses of split lots using IDS Datapower software to drive process change decisions.
• Implemented BEOL yield improvements, corrected process excursions, and reduced scrap in dual damascene architecture and copper fill/CMP modules, while directing multinational teams composed of unit process and defect.
• Collaborator with process engineering teams to expand manufacturing capacity and qualify tool start-ups for rapid new product introduction and manufacturing cycle time.

• Hands-on engineering of copper/low-k dielectric interconnect technology in a 200mm wafer lab/fab, and transferred learning to high-volume production.
• BEOL metals integrator focusing on CVD and ALD diffusion barriers for 90nm and 65nm technology nodes to ensure production-worthy copper interconnects.
• Partner with industry-leading semiconductor equipment suppliers (including Applied Materials and Novellus) to gain competitive advantage using advanced tool solutions for next-generation BEOL metals deposition.

Master Of Science - Ms, Mechanical Engineering

Bachelor Of Science - Bs, Mechanical Engineering