Christopher Koay Email & Phone Number

Singapore

Responsible for FA support which includes EFI & PFA on Fab's rejected wafer for yield enhancements, quality & reliability, failure characterization, qualification failures as well as customer returns failure. Work closely with cross-functional departments to provide FA technical knowledge for root cause finding.Working with NXP teams on partnership projects to setup dynamic failures such as Functional SCAN and MEMORY Bitmap capability.

Singapore

Responsible for both EFI and PFA which includes electrical brench test verification (IV), fault Isolation, PVC, CAFM, decapsulation, layer by layer deprocessing, SEM inspection, EDX, progressive FIB, TEM cross-sectional cut till the defect be found. Compile test data, fault isolation data, FA images into the final FA report and presenting to relevant party.Hands-on skills/experiences: System-based tester, SEM, Photo-emission(PEM), ORBICH, Parametric Analyzer, Curve Tracer… Show more Responsible for both EFI and PFA which includes electrical brench test verification (IV), fault Isolation, PVC, CAFM, decapsulation, layer by layer deprocessing, SEM inspection, EDX, progressive FIB, TEM cross-sectional cut till the defect be found. Compile test data, fault isolation data, FA images into the final FA report and presenting to relevant party.Hands-on skills/experiences: System-based tester, SEM, Photo-emission(PEM), ORBICH, Parametric Analyzer, Curve Tracer, Micro-probing, CAFM, layer by layer de-processing, RIE, progressive FIB, TEM X-Sec sample preparation, Microscopy, Circuit & Layout analysis. Show less

Singapore

Penang, Malaysia

As a R&D Failure Analysis Engineer,responsible for failure analysis from production and customer return products by doing fault isolation in order to identify the defect that cause the product failure. Working with cross-sectional team members as require supporting to work with the cases. Mainly focusing on Cache test, analyzing the defective part (IC) and localizing the failing location based on the failing mode & signatures which leads to root cause determination for improvement in… Show more As a R&D Failure Analysis Engineer,responsible for failure analysis from production and customer return products by doing fault isolation in order to identify the defect that cause the product failure. Working with cross-sectional team members as require supporting to work with the cases. Mainly focusing on Cache test, analyzing the defective part (IC) and localizing the failing location based on the failing mode & signatures which leads to root cause determination for improvement in quality & reliability towards manufacturing excellence. Supporting products that used in Internet of Things market segment. Show less

Kulim, Malaysia

• As an Electrical Test Engineer and BOM Engineer • Supporting NSG to validate on new design solid state drive (SSD).• To validate and perform a stability check on electrical design, related to the Product Requirement Document (PRD) using worst case voltage and temperature conditions on typical silicon processes. • Mainly focus on Power Supply Validation and Signal Integrity Validation which includes:1. Power Cycle2. Hot Plug Test3. Power-Up Sequence4. PLI Mode5.… Show more • As an Electrical Test Engineer and BOM Engineer • Supporting NSG to validate on new design solid state drive (SSD).• To validate and perform a stability check on electrical design, related to the Product Requirement Document (PRD) using worst case voltage and temperature conditions on typical silicon processes. • Mainly focus on Power Supply Validation and Signal Integrity Validation which includes:1. Power Cycle2. Hot Plug Test3. Power-Up Sequence4. PLI Mode5. Operating Limits Measurements6. SDRAM, NAND and SPI Signal Integrity• Set up the automation test using EVA.exe based on test plan given.• Do analysis on result from waveform captured to ensure meet the board architecture specification (BAS).• Supporting to review on birth of material (BOM) checklist to ensure all the components meet the checklist requirement and enable the NSG PCBs tape out on schedule. Show less

Cheras, Kuala Lumpur

Design and modify construction drawing using AutoCad software, prepare weekly work progress report and attend site meeting.

Bachelor Of Engineering (Beng), Electrical And Electronics Engineering, 1St Class Honours

Awarded Hallam Special Achievement Scholarship in Sheffield Hallam University 2014

Advanced Diploma, Electronics Engineering, First Class Honours 1

Activities and Societies: Football Team, Final Year Project Competition, Seminar for System Design using Verilog and Innovation Awarded.

Diploma, Electronic Engineering, First Class Honours 1

Activities and Societies: Football Team, Badminton Team