工作經歷 Working Experience (6 years and 2 months of semiconductor GaAs development engineer and 4 months of IC design RF power cell development engineer):RichWave Technology Corporation.• RFIC Power Cell Development Principal Engineer – Aug. 2021~Core Mission: Evaluate new power cell's RF performance including load-pull power performance, EVM performance, and spectral mask performance . Enhance power cell's performance via approaches of design and simulation.WIN Semiconductors Corporation.• GaAs Technology Development Staff Engineer – Jan. 2021~Dec. 2023Core Mission: Release high integration novel GaAs pHEMT technology / GaAs customized technologies development• HBT Technology Development Engineer/Staff Engineer – Nov. 2017~ Jan. 2021Core Mission: Release advanced process layer to enhance targeted technology features / GaAs and InP HBT device developmentIntern of U-Tech Media (Jul. 2014–Sep. 2014)Core Mission: Refine product flatness by Photo Lithography process學歷 Education Background:Master degree, Department of Electrical Engineering, National Central University (Jul. 2015–Jul. 2017)Thesis: «Heterojunction Tunnel Field-Effect Transistors with Composite Channel»Article: «GaAsSb/InGaAs heterojunction tunnel field-effect transistors with a heterogeneous channel», JJAP, February 2018Bachelor degree, Department of Electronic Engineering, Chang Gung University(Jul. 2011–Jul. 2015)High school degree, Science major, Taoyuan Municipal Wu-Ling Senior High School(Jul. 2008–Jul. 2011)語言及專業能力 Language and Professional skills:• Chinese: Mother language• English: Advanced (2024/04/28 TOEIC score: 865 Golden Certification)• Key skills:New technology development, APQP qualification, Cooperation between departments, Failure Analysis, Reliability verification, Experiments design, Layout design, Device DC/RF characteristics analysis and measurement, Process route establishment, Control experiment LOTs, PCM monitor, Layout design rules establishment, Cell library design, PDK establishment, Load-Pull system establishment and measurement, Characteristic evaluation of Wi-Fi Specification, Impedance tuning on EVB/PCB• Vidas EDA system (Inline monitor/PCM/Characteristics analysis)• Origin / IC Cap / Keysight ADS Simulation• Semiconductors Process (Photolithography/Etching/Thin-Film/Backside)• Microsoft Office (Excel, Word, PowerPoint)
Listed skills include Channel Partners, Solution Selling, Product Development, P&L Management, and 11 others.