Chetan Kumar Email & Phone Number

Madison, Wi, Us

• Driving product development for the CyberKnife product to expand the curative power of radiation therapy.

Minneapolis, Mn, Us

• Technical and Functional Excellence Leader for a team of 28 Operations Program Managers.• Introduced innovative business practices and operational mechanisms, resulting in highly predictable and efficient new product launches.• Implemented Design for Six Sigma practices to apply technical rigor, structured methodologies, and effective program management principles. Developed and deployed a Design for Manufacturing methodology.

Minneapolis, Mn, Us

• Successfully doubled the team of Operations Program Managers from 15 to 30 individuals worldwide through innovative hiring and talent development methods, earning a corporate award for diversity and inclusion.• Managed all operations aspects of new product development, from value stream selection to planning, execution, design transfer, and implementation, while emphasizing robust Design for Six Sigma practices.• Collaborated with stakeholders in R&D, PMO, Marketing, Finance, Released Products, and Operations Sites worldwide to ensure flawless launches for 5 different business units.

Minneapolis, Mn, Us

• Led the development of a disruptive pacemaker design through all phases, maintaining schedule, budget, and product quality.• Managed a cross-functional operations team involving manufacturing, supply chain, sourcing, medical packaging, sterilization, and pharmaceutical functions across 5 different operations sites.

Minneapolis, Mn, Us

• Led a team responsible for the development, sourcing, and operations of microelectronic components used in medical devices, serving as the primary interface to suppliers.• Managed all engineering issues with over 50 suppliers, overseeing an annual expenditure of $80+ million.• Accountable for engineering activities throughout the product life cycle, including concept definition, sourcing, qualification, manufacturing integration, and operational performance.

Minneapolis, Mn, Us

• Leading an engineering team responsible for the development, sourcing and operations support of microelectronics used in medical devices.• Responsible for all engineering activities throughout the product life cycle, which includes concept definition, sourcing, qualification, manufacturing integration, and operational performance.• Primary interface to suppliers during all phases of development and production.• Manager of a team of engineers responsible for working with suppliers to drive improved quality, reduced lead time and cost, along with growth without capital expenditure.

Minneapolis, Mn, Us

• Led the engineering efforts for ensuring the reliability, quality, and compliance of new products, with a focus on microelectronic packaging integration for medical device applications.• Developed, published, and deployed a functionally based FMEA methodology that linked high-level system requirements to component-level failure modes and effects across the corporation.

Santa Clara, California, Us

• Managed a team of nine that certified the next generation of low power and environmentally friendly CPU electronics package technologies in 2009.• Lead engineer for the 32 nanometer generation of microprocessor packaging technology.• Responsible for the planning, execution and deployment in the area of quality and reliability.• Leveraged methodologies such as FMEA, effective DOE design and reliability statistical modeling to drive down risks and development times of this new technology.

Santa Clara, California, Us

• Developed cutting-edge electronics package technologies for the wireless handheld market.• Increased the reliabilty of lead-free solder joint interconnects by over ten fold that led to the launch of multiple flash and logic handheld-market processors.• Drove the certification of lead-free solder joint package technologies which enabled the shipment of over 60 million flash units to Nokia, 3 million units/quarter to RIM, and the first 5-die stacked package to Motorola.• Created business processes to enable a robust solder joint reliability testing infrastructure across multiple geographies and organizations.

Santa Clara, California, Us

• Developed new tools and techniques to predict electronic package thermal performance by leveraging analytical and experimental skills.• Developed finite element modeling methodologies to assess the impact of design changes to overall system thermal performance. Modeling results were used to influence key technology decisions.• Developed experimental thermal metrologies for desktop, telecom, and handheld applications. New tests were developed to allow up to 50% more measurement accuracy and 100% faster unit preparation than previous methods• Leader of a cross-functional that certified a new thermal interface material enabling the launch of the first products into the telecommunications market segment.• Designed benchmarking test techniques to acquire thermal data from competitor systems.

Dearborn, Michigan, Us

• Developed technologies for the first hybrid gas-electric vehicle and fuel cell vehicle.• Optimized emissions and vibration to boost performance of the Ford Escape Hybrid.• Developed the drive train for a prototype fuel cell vehicle by managing multiple suppliers.

Ms, Mechanical Engineering

Bs, Mechanical Engineering