In charge of CEO and the founder of CoX Space.

I had worked in MediaTek Korea as HW Customer Program Manager since joined on July 2016, and responsible for Project management and Technial Marketing for Mobile Biz, Automotive Biz, IOT Biz. Role of HW Program Manager.- Projects management and scheduling for LG mobile and clarify issues- Technical product marketing and Promotion MTK new products @Mobile/Automotive/IoTfor LG Mobile/LG VC, Hyundai Mobis/Motors/NAVER. Achievement: - Supported LG smartphone projects mass production - Promotion for new MTK smartphone products for LG Mobile - Promotion support for Telematics, IVI, Automotive products for LG VC and Hyundai Mobis/Motors - Promotion and made concept United IVI system for NAVER - Promotion support for the Radar product for APS(Automatic Parking System) of Hyundai Mobis

 Baseband HW Staff Engineer & Hardware Project Manager  Department: Customer Technical Solution (CTS) Department. Customer:  LGVC: Automotive Telematics Projects (2015.7 ~2016.6) Telit: Automotive Telematics Project (2015.7 ~ 2016.6) Samsung: Smartphone@including flagship and Tablet PC (2011.2 ~ 2015.7) :Supported Mass production with application of Intel CP(Communication processor) platform@LTE/3G for Samsung flagship projects such as Galaxy S3/S4, Note3_Neo, Galaxy Tab III, S-Alpha, Etc.Skill Set:  - Making Architecture and Schematic Review and PCB layout/Simulation for Automotive system such as TCU/TCAM/NAD - HW Project management for flagship project. - SI/PI Simulation for Automotive project based on Ansys@SIwave and Cadense@Sigrity. - Issue Analysis and report - Power Consumption Optimization. Strong point - Process innovator - System developer - Technical marketing for Promotion - Overall HW expert/System Architecture - Certificate of 'Project Management Training' - Idea Creator

Feb.2011 / Merged by Intel  Customer:  Samsung EP(Entry Phone for 2.5G)Achievement in Infineon. Mass production with following Single chip(Application processor and Communication processor) platform. Samsung 2.5G projects (Oct.2010 – Aug.2011)- 2Mp Camera(3.2Mp Camera with Jpeg I/F), FM stereo RDS receiver, QVGA display, Stereo headset(class D amplifier), RF Transceiver, Direct-to-Battery Connection, Charging control.Skill Set:  Analysis Issues and Schematic Review and PCB layout for BB/RF/LCD/Camera /Audio.

Achievement in Corelogic. Mass production of Samsung flagship projects such as SGH-D900/D900i with application of Multimedia chip platform.- 3.2Mp Camera,Mpeg(CIF 30f/s),JPEG(3M),Mp3,TV_out, H.264, Non OS.Skill Set:  Analysis Issues and Schematic Review / PCB layout and SW driver(Firmware) engineer for Multimedia function Such as LCD module /Camera ISP Module /MP3 codec/ Analog TV out function and Jpeg/Mpeg/Mp3(3D effect and EQ)