Craig Carpenter Email & Phone Number

Boston, Ma, Us

Milford, Ma, Us

Responsible for IC Manufacturing Business Unit

Milford, Ma, Us

Manage backend manufacturing process including:- Wafer Probe- Wafer Laser Trim- Package and Assembly- Final IC Package Test- Planning Department- Quality Department

Sunnyvale, Ca, Us

• Manage introduction new back end processing technology• Highly visible project internally and to customer• Extremely aggressive timeline• Serve as face to the customer• Manage team consisting of engineering, operations, and supply chain.

• Led the qualification of all externally manufactured components and the qualification of specific internal fab package technologies. • Served as a key member in the development of package technologies. • Contributed significantly in response to customer quality issues. • Interfaced with customers and executive level management. • Developed aggressive component roadmaps to meet key customer intercepts.• Extensive travel to Skyworks and supplier sites in throughout United States and Asia.

• Acted as an interface between nationwide design community and Woburn manufacturing facility.• Contributed to the team that interfaced between the international filter community and Skyworks. • Led the introduction of new technologies from a logistical perspective to Woburn facility.• Task with increasing efficiency of new products from concept to materialization. • Streamlined communications, serving as the single point of contact to manage the message.• Targeted higher order issues, increasing simulation and modeling accuracy, and improving the usefulness of process control monitors.

• Directed the build manufacturing process for bulk acoustic wave devices (BAW) RF filtration line.• Engineered full development and characterization starting at the resonator level.• Created a production process with acceptable process capability (CpK) levels.• Communicated and presented to executive management team; directed a team of 15+.• Applied knowledge of circuit design, circuit modeling, test engineering, process engineering, and manufacturing processes.

• Primary engineer for dry plasma etch, wet chemical etch, and SEM measurement areas.• Orchestrated new tool selection and qualification, cycle time reduction, process sustainment, development, improvement, cost reduction, product, and product problem-solving. • Applied understanding of DOE and statistical process control (SPC) techniques; managed a team 3 engineering technicians.

Bachelor'S Degree, Electrical Engineering

Master'S Degree, Electrical And Electronics Engineering