Product Development Engineer
CurrentAchievement - Handling over 5 foreign customers and over 50 NPIs - Deal with different type of PCN (M/C qualification/Material validation) - Involved critical issues and drive internal team for actions preparation - Good coordinate and teamwork with internal for issue investigation - Cross functional communication and issue discussion Capability - In charge of various of NPI products (WLCSP / BGA) - Familiar with semiconductor back-end processFor Bumping > Plating Bump 0P1M / 1P1M > Solder Ball 2P2M / 3P3MFor ASSY > Wafer grinding / Laser groove / Saw dicing > Die bond & SMD / Underfill / Lid attach / Ball attach > Wafer/Die inspection (AOI 2D and 3D / PNP) - Product management > Product design review and risk assessment > Process flow setup and review > Process inline data review and integration > PCN preparation > Handling customer audit/visit - Process issue investigation > Failure analysis review and root cause analysis > Internal coordination and discussion > 8D report preparation - Other skills > Coordinate with customer/internal team > Work independence > Fluent English communication (2020 TOEIC 700)