Curtis Liang Email and Phone Number

Be responsible for CD ATM factory packaging related project and quality issue.Be familiar with Wafer/Die/Chipset/CPU packaging design and test, supplier material qualification to check material performance and meet factory FM(particle) requirement.Work as industrial engineer for Intel Asia finish goods warehouse, be responsible for warehouse workforce planning, machine (ASUIT, AGV, ASRS, Automachine) and material management, process optimization and bottleneck analysis via digital twins, environment and layout design.

Develop packaging for Server, board and corresponding FRU spare.Define requirement to ODM, packaging design & qualifictaion, material BOM management, SnV、Environment、material strength test and FEA analysis understanding.Be responsible for SH Finished goods warehouse packaging related project and issue.Manage shipment data dashboard, which monitor international shipment environment with real-time sensor technology.Find potential risk such as shock, vibration, temperature and humidity problem during and improve packaging development.

As a marketing intern ,actively assist manager in optimizing packaging structure of light and related products.Accomplish requirement from customers and ask supplier to do FAI sample, finish over 80 lights or bulbs' packaging.Be responsible for insert, white box, color box, blister, show shelf, die-cut drawing and label printing lay out.Have strong patience and responsibility, have good ability to communicate, find and solve problem.