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Dallas Lea is listed as Senior Software Development Engineer (IBM Research) at IBM, based in Alexandria, Louisiana, United States. AeroLeads shows a work email signal at ibm.com and a matched LinkedIn profile for Dallas Lea.
Dallas Lea previously worked as Senior Characterization Engineer (IBM Research) at Ibm and Adjunct Faculty at Dutchess Community College. Dallas Lea holds Doctor Of Philosophy (Phd), Electrical Engineering from University Of Virginia.
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AeroLeads found 1 current-domain work email signal for Dallas Lea. Compare company email patterns before reaching out.
Recently transitioned to new role as a cloud software developer for Electronic Design Automation as a Service. New role combines my completion of a 9-month IBM Research program in Software Engineering for Scientists (SE4Sci) with my 25+ years of industry research and development experience across a broad range of semiconductor integrated circuit (IC) types (logic, SRAM, DRAM, nonvolatile memory, analog).Experience prior to SE4Sci included the following: Design and layout of IC test structures, definition of inline electrical tests during wafer fabrication and offline tests of completed wafers. Design of process integration experiments and analysis of electrical characterization data to evaluate experiments, estimate defect density, and influence device (MOSFET, resistor, capacitor) models. Circuit simulation to select device design points for maximum yield and assess model accuracy against hardware data. Three U.S. patents. Independent development of educational package and teaching of internal short courses to improve cross-functional understanding of SRAM circuits used for technology qualification. One semester of college instructional experience teaching a sophomore level electronics lab as an adjunct faculty member.Detailed academic background (M.S/Ph.D. thesis/dissertation research) in fabrication and characterization of low temperature superconductor (niobium) tunnel junctions, for millimeter wave radio astronomy application of the Josephson junctions that have now also become a key platform for quantum computing.ORCID publication record: https://orcid.org/0000-0002-3549-1351
Listed skills include Eda, Cmos, Vlsi, Semiconductors, and 13 others.
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Armonk, New York, Ny, Us
Applying extensive semiconductor design background to the establishment and testing of cloud-based infrastructure for Electronic Design Automation as a Service- began new role after completing 9-month IBM training program in Software Engineering for Scientists
Armonk, New York, Ny, Us
Applied comprehensive characterization background to research setting introduction of development-like yield learning methodologies for integrated circuits- technologies advanced through yield learning: FinFETs, Nanosheet FETs, EUV-patterned interconnects, MRAM, Phase Change Memory- methodologies established for designing defect monitors, quantifying defect density from their electrical yields, and using those results to evaluate health-of-line and draw sound conclusions from experiments- integration of electrical defect monitor, device parametric, and functional memory test data with inline inspections and failure analysis electron microscopy to prioritize yield detractors in a pareto format- parametric test structure design to leverage throughput advantage offered by parallel testers
Poughkeepsie, Ny, Us
Taught electronic circuits lab to second-year engineering students
Malta, Ny, Us
Nonvolatile memory (NVM) hardware research and development - design and characterization focus on both established and experimental architectures - test definition and data analysis to evaluate program/erase conditions and process experiments
Armonk, New York, Ny, Us
Design and characterization of test structures for a broad range of integrated circuit technologies across ten generations of Moore’s Law scaling, from 350 nm to 14 nm nodes. Development and analysis of tests to evaluate fabrication process experiments, sustain existing processes, and find viable biasing and programming conditions.- circuit types ---- SRAM, DRAM, CMOS digital logic---- MOS current mirrors and analog (differential pair) oscillators---- one-time programmable (e-fuse) and multiple-time programmable (charge trap) NVM- test structure design---- experiments (device types and geometries), layouts, schematics, SPICE simulations- test structure characterization---- specification of appropriate test conditions, translation of conditions into test code---- analysis of inline & laboratory bench test results with JMP, SAS, Excel, & IBM internal softwareTarget specification and evaluation of semiconductor device mathematical models for SPICE simulations- determination of SPICE model targets meeting technology objectives for benchmarking metrics (e.g., SRAM yield, analog oscillator gain-bandwidth product)- comparison of SPICE simulations against wafer test results to enable tuning of models and fabrication process parameters during process development
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Dallas Lea works for IBM.
Dallas Lea is listed as Senior Software Development Engineer (IBM Research) at IBM.
AeroLeads has found 1 work email signal at @ibm.com for Dallas Lea at IBM.
Dallas Lea is based in Alexandria, Louisiana, United States while working with IBM.
Dallas Lea has worked for Ibm, Dutchess Community College, Globalfoundries, and Ibm Microelectronics.
You can use AeroLeads to view verified contact signals for Dallas Lea at IBM, including work email, phone, and LinkedIn data when available.
Dallas Lea holds Doctor Of Philosophy (Phd), Electrical Engineering from University Of Virginia.
Dallas Lea is listed with skills including Eda, Cmos, Vlsi, Semiconductors, Simulations, Circuit Design, Electrical Engineering, and Ic.
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