Dan Thiessen Email & Phone Number

Develop test code to test MEMS sensors such as gyroscopes, accelerometers, microphones, etc for customers using the Solidus STI3000/9000 test systems.

Develop tests for FRAM devices, both at package and wafer level with the testing performed on the NexTest Maverick and Magnum ATE platforms. The ongoing support involves improving tests for reduced test time, better throughput, and higher test coverage.

Managed the production testing of the circuit boards used in the BenchTree products, both the surface and downhole lines. Testing is performed at both room and hot with the temperatures being elevated to 175C for the production testing of the downhole products. Extensive interface with both production and design engineering with a primary goal of implementing a more automated production test flow allowing for data collection/analysis to assure high quality while improving throughout and reducing overall costs. Developed automated tests written in C# used to capture and analyze test data using data acquisition instruments.

Koto-Ku, Toyosu, Tokyo, Jp

Intersil acquired Zilker Labs at the end of 2008. Initially, the testing continued to be done on the NexTest Maverick platform but the decision was made to convert the test to the Teradyne Flex platform. The test was setup as a quad site test with the testing being done at a test house in Malaysia. I continued to support the testing and qualification of new products as I had done at Zilker Labs along with working with design to improve the overall product quality. During this time the production volumes increased from less than 100,000 units per year to several million units yearly. The breadth of the product line also continued to grow as new devices were developed to support higher voltage and current in the application spaces. The testing and calibration changed to support this increasing capability in the devices.

Us

I supported the test development for the digital power management chips developed at Zilker Labs. These were buck converters that had embedded NVRAM, SRAM, and a processor to control the regulating functions as well as the ability to report the telemetry results of the operation of the chips. The devices were two die solution which required calibration routines to allow for the accuracy to meet the data sheet specifications. The testing was done on a NexTest Maverick tester. The first testing was done on a Maverick PT which was single site setup with future testing to be done on Maverick GT which would be quad site. I also designed the boards for the qual testing and oversaw the qualification process.The initial testing was done a test house in the US with the plan to move to a test house in the Phillipines as the production ramped up. I coordinated the overall testing process and as the volumes were starting to grow, supervised a team the supported the production, qualification, and testing development. I worked closely with the design engineering in assuring that new devices were designed for testability (DFT) and to improve the overall quality of the final product.

SMTSInitially, the testing for the AC97 audio codecs was done on Credence Vista / Duo testers. This was a single site test setup and test houses in both Singapore and South Korea were utilized. The fabs were also located in those countries and I developed and supported the testing of all the audio codec products. As the volumes grew, the need developed for a lower cost test solution and the KVD M2 testers were selected to replace the Credence systems as it would be a dual site test with a lower overall test cost. I setup the tests and the KVD testers were installed in South Korea and in multiple locations in Taiwan. Sigmatel continued to grow, expand, and eventually went public. As the number of products increased along with the volumes, other test engineer and product engineers were added to the company. I served as an interim manager for the test engineering group during this time. Due to the production volumes increasing, the test platform was changed from the KVD testers to Teradyne J750 systems that allowed us to go to quad site testing.I moved to doing DFT for the codecs, returning to the type of work I had done at IBM, adding the scan chains to chips, generating the scan patterns and verifying the test coverage.

I directed the testing of the motherboards used in the Hyperstations. As part of this testing, I led a group to setup a four corner chamber to test the motherboards across the range of temperatures and input voltages as the boards ran diagnostics for a 24 hour period. Two chambers were configured with a workstation running controlling the chamber and power supplies and serving as an interface to the boards running in each of the chambers. I wrote the code for setting up the tests, monitoring the tests, and analyzing the results. The test was written in TCL/TK/Expect with a separate application that had a GUI for remotely monitoring the test activity.

Bs, Electrical Engineering

Me, Electrical Engineering

Mba, Business