Consultant services for improving PCB front-end engineering processes, OEM DFM reviews, Asian PCB fabricator selection/approval, PCB acceptance specification and technology roadmap creation/updating and IPC-2581 data transfer. Provide innovated CAD and CAM software functional requirements to reduce NPI cycles, reduce product cost and improve PCB quality assurance.

Responsible to ensure industry standards reflect Additive Manufactured Electronics (AME) requirements.

Lead PCB multi-site 200+ person front-end DFM/DFx engineering and NPI team with revenues over $400M. Improved quality by greater than 90%; improved productivity by 200+%. Worked with tier one customers to substantially reduce NPI issues. Active member of IPC-2581 data transfer committee. Installed automation to reduce cycle time by 30% and improved customer DFM response time by days.

Responsible to create and implement technical direction and execution for over $1 billion USD of printed circuit board purchases. Based in Shenzhen, China corporate headquarters. Lead a 20+ person engineering team. PCB technology ranges from high volume mobile phone/tablet HDI and FPC, mobile broadband modules, high frequency cellular base station power amplifiers, microwave modules and large antenna’s, high current/voltage power distribution boards and high performance/low loss router, data center and optical technologies. Support global product development organizations.• Averaging over 20% year-over-year cost reductions with 20-50% quality improvements.• Established world class supplier qualification, capability verification, and performance KPI’s. • Added global advanced PCB fabricators to the existing low to high technology base.• Created technology specific technology matrix based roadmap that is used to guide product development and qualify/provide future requirement guidance to fabricators.• Developed patented technologies which are manufactured with Chinese suppliers.• Two patents pending for novel interconnect techniques and PCB material combinations.

Responsible to identify, create teams, create metrics then implement lean six sigma based process improvements and product cost reduction for 6 fabrication facilities in US and Asia. Oversee manufacturing automation, business systems processes and product engineering. Lead 12 direct reports, with dotted line oversight of 200+ employees. Define and implement standardized software packages to replace multiple business systems and business practices across divisions. Ensure product regulatory compliance with a wide array of standards, including UL, military, ITAR, Telcordia, and RoHS/REACH. Support key and target clients design teams with technical marketing presentations.Member of senior staff who grew business from $120 million to $400 million following recession and business redefinition.Lowered pull system cycle time and process cost by more than 50% at multiple plants while improving engineering quality by greater than 10 times utilizing lean, six sigma, best-of-class, value stream mapping, Kaizen events, etc. processes.Process improvements involved cross-functional teams from Customer Service, Procurement, Engineering and Manufacturing. Defined and implemented an externally developed innovative standardized engineering software system across all facilities which reduced product transfer time more than 50%.Responsible to integrate differing business architectures following mergers of Zycon, HADCO, and Sanmina as senior member of corporate integration team.Reduced transfer errors by 90% through common client design transfer process between US and Asian facilities.Certified Master Six Sigma Lean Manufacturing Black BeltCoordinate all PCB fabrication design rules and work with customers on high density, high reliability and signal integrity constrained designs for many industries (e.g., telecom, military, industrial)

Spearheaded all Front-end Engineering Engineering department operations, with direct oversight of 5 managers and ~70 engineers/CAM technicians. Devised project plans, budgets, and schedules, ensuring proper staffing.Was acquied by Sanmina.

Spearheaded all R&D and Test Engineering department operations, with direct oversight of 3 engineers. Provided line management, concept definition, product specifications, client qualification, and production release in cooperation with major clients and sales personnel. Designed and deployed rules and manufacturing processes for multiple products. Directed engineering, manufacturing information systems, and electrical test process engineering teams. Devised project plans, budgets, and schedules, ensuring proper staffing.Developed first polymer thick film (PTF) resistor technology for embedding into PCBs.Created and released laser blind via drilling process.Grew patented buried capacitance technology and new material work, including qualification of new suppliers and facilitation of qualification by OEMs.Was acquired by HADCO

$500 million R&D Company, a wholly funded subsidiary of Northern Telecom.; Directed 12 engineers plus development teams in Ireland, Canada, and Israel. Drove product development process through all phases from specifications to testing and manufacturing introduction in 3 North American locations. Managed outside plant cabinet, fiber-in-the-loop, and client-located equipment systems design for transmission telecommunications division equipment generating over $300 million in annual sales revenue. Cut development cycle time from 3 years to 8 months with concurrent engineering practices.Built engineering group from ground up to superb functionality.Developed and implemented first industry system able to survive a hurricane.Introduced 3D solid modeling to mechanical design process.Created and delivered first 100% electronic prototype in company history.

Technology Director, Interconnect Technologies. Co-founded company and developed numerous PCB designs with leading manufacturers. Managed R&D, application engineering, technology, PCB layout, and IT departments. Implemented design techniques using laser drilling interconnect, and SMT manufacturing equipment and process.

Electrical/Mechanical packaging design, signal integrity design. Managed advanced packaging development projects through all stages. Led team implementing largest SMT assemblies in the world at the time. Established SMT process/design and signal integrity design rules for 10K & 100K ECL..

Computer packaging design and gate array specification and test. Developed first DRAM Memory board and developed EMC and propagation models/rules for mini-computer product.