Dan Boyne Email & Phone Number

Austin, TX, US

Austin, Texas Area

United States

• Responsible for design of packages for automotive applications.
• Managed global team of designers in US, Taiwan, China, and Malaysia.

United States

• Responsible for design of packages for automotive applications.
• Managed team of designers in US, China, and Malaysia.

Austin, Texas Area

• Manage 12 employees in Austin and Phoenix responsible for developing new package technologies for 32-bit MCUs, pressure-/motion-sensors, and 77 GHz radar products.
• Achieved technology milestones for packages to support automotive microcontroller products, 77 GHz radar products, and sensor products.
• Familiar with manufacturing of BGA, RCP, WLCSP, and leadframe packages.

• Assessed electrical performance of package designs, including flip-chip, wirebond BGA, and leadframe packages. Used 3D parasitic extraction tools from major EDA vendors to create s-parameter and SPICE models of packages.
• Improved modeling throughput 25% using software automation while leveraging existing Linux infrastructure.
• Benchmarked competitors' package designs through reverse-engineering, resulting in design improvements to Freescale’s flip-chip packages.

• Failure Analysis Lab Manager
• 2008 – 2011
• Managed failure analysis (FA) activities for a variety of advanced CMOS technologies. Responsible for staffing, training, budget, and capital purchases for electrical and physical FA teams comprising 30+ Austin.
• Increased FA productivity 11% by streamlining inter-department transactions and standardizing internal processes. Improvements significantly increased department’s readiness for new products.
• … Show more Failure Analysis Lab Manager
• Coordinated $21M of capital purchases for the global Quality organization from 2006 to 2010. Worked closely with Asia, Europe, and US FA and reliability labs to prioritize and justify capital investments based on ROI.

• Implemented process and test enhancements to improve yields for high-volume semicustom product lines with run-rates of 1000 wafers/week. Analyzed electrical and failure analysis data to identify and eliminate root.
• Successfully transferred wafer manufacturing processes between fabs, with significant interaction with Product, Design, Test, and Manufacturing Engineering.

• Assessed reliability of advanced bipolar semiconductor devices for high-end mainframe systems. Modeled device reliability using lab results.
• Generated recommendations for design, manufacturing and test engineers to improve reliability of VLSI products.

Ms, Materials Science And Engineering

Emphasis on thin-film epitaxy

Bs, Applied Physics

Activities and Societies: Research in high-temperature superconductors. Officer of Physics Club. Varsity tennis. Minor in Psychology