Dane Scott Email and Phone Number
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Patents in: Die Bonding MOCVD shower heads PrecursorEvaporators Fiber Optic Transponder AssemblyDeveloped: EPA Abatement Equipment Test Systems Semiconductor Bubbler Systems Specialty Gas Delivery Systems Vision Controlled Die Bonding MOCVD Wafer Transport SystemSpecialties: Semiconductor Gas/Liquid delivery systemsGHG test systems
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Senior Engineering Fellow R And DMatheson Tri-GasMontgomeryville, Pa, Us
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Senior Engineering Fellow R&DMatheson Tri-Gas 2002 - Present
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Engineering Program ManagerOptronix Nov 2000 - Jun 2003• Designed Automation equipment for fiber optic assembly in 10 gigahertz optical transmitters and receivers.2 patents in application• Design of lead cutting equipment.• Installation and application of laser welder for hermetic package• Consultation on wire bonders and 5 micron die bonders• Manage cost and yield improvement systems for production of transponders and components.• Provide design of fixtures and components using Pro Engineering Cad system
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Chief EngineerEmcore Jul 1994 - Nov 2000• Design of Magnetic Levitation for High Vacuum Compound Semiconductor Epitaxy Chamber (patent applied for).• Design of Cassette to Cassette Robotic feed system for MOCVD Equipment.• Design of Liquid Delivery System including Evaporator( 2 patents) and pump feed system for high and low dielectric strength ('k') materials and other dissolved solids (BST, PZT Copper etc.).• Design of Modular Growth Chamber Flow Flange (patent recieved).• Design of automated wafer carrier transfer systems for Large production Epitaxy Growth equipment. • Design multi-chamber cluster tool for high volume Gallium-Arsinide and Gallium-Nitride epitaxial wafer growth. (Gov. Contract # F19628-94-C-0114)• Design of 8 channel, ISA bus, process control board with individual channel auto-tune and ‘ON_BOARD’ processor. -
Engineering Program ManagerAssembly Technologies Oct 1989 - Jul 1994• Created semiconductor wafer saw using new concept slide system (patent), PC-BUS control system with touch screen, icon based user interface, “C” programming and PID motion control.• Managed program with IBM Burlington to design and build production die-bonders for IBM's proprietary "A-wire" package concept to be used with 16 and 64 megabit DRAM chips.• Managed market research, product design and engineering program to produce high accuracy vision controlled Die bonder for Silver-Glass application. 2 Patents for paste application system, and vision control systems.
Dane Scott Skills
Dane Scott Education Details
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Radiation Safety -
Kodak UniversityIndustrial Radiography -
Mechanical Engineering
Frequently Asked Questions about Dane Scott
What company does Dane Scott work for?
Dane Scott works for Matheson Tri-Gas
What is Dane Scott's role at the current company?
Dane Scott's current role is Senior Engineering Fellow R and D.
What is Dane Scott's email address?
Dane Scott's email address is ds****@****gas.com
What schools did Dane Scott attend?
Dane Scott attended Northwestern University, Kodak University, University Of Pennsylvania.
What skills is Dane Scott known for?
Dane Scott has skills like Semiconductors, R&d, Engineering, Manufacturing, Design Of Experiments, Product Development, Materials, Cvd, Process Engineering, Automation, Thin Films, Materials Science.
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Dane Scott
I Am Ready To Help You And Those You Care About Most To Reach Their Financial And Life GoalsSterling, Va -
Dane Scott
Full-Time Voice-Over Studio, Owner/Manager At Dane Scott Productions / Tunetracker SystemsGreen Bay, Wisconsin Metropolitan Area -
Dane Scott
Greater Tampa Bay Area1ies-co.com
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