Dane Scott Email & Phone Number

Montgomeryville, Pa, Us

• Designed Automation equipment for fiber optic assembly in 10 gigahertz optical transmitters and receivers.2 patents in application• Design of lead cutting equipment.• Installation and application of laser welder for hermetic package• Consultation on wire bonders and 5 micron die bonders• Manage cost and yield improvement systems for production of transponders and components.• Provide design of fixtures and components using Pro Engineering Cad system

• Design of Magnetic Levitation for High Vacuum Compound Semiconductor Epitaxy Chamber (patent applied for).• Design of Cassette to Cassette Robotic feed system for MOCVD Equipment.• Design of Liquid Delivery System including Evaporator( 2 patents) and pump feed system for high and low dielectric strength ('k') materials and other dissolved solids (BST, PZT Copper etc.).• Design of Modular Growth Chamber Flow Flange (patent recieved).• Design of automated wafer carrier transfer systems for Large production Epitaxy Growth equipment. • Design multi-chamber cluster tool for high volume Gallium-Arsinide and Gallium-Nitride epitaxial wafer growth. (Gov. Contract # F19628-94-C-0114)• Design of 8 channel, ISA bus, process control board with individual channel auto-tune and ‘ON_BOARD’ processor.

• Created semiconductor wafer saw using new concept slide system (patent), PC-BUS control system with touch screen, icon based user interface, “C” programming and PID motion control.• Managed program with IBM Burlington to design and build production die-bonders for IBM's proprietary "A-wire" package concept to be used with 16 and 64 megabit DRAM chips.• Managed market research, product design and engineering program to produce high accuracy vision controlled Die bonder for Silver-Glass application. 2 Patents for paste application system, and vision control systems.

Certified, Radiation Safety

Certified, Industrial Radiography

Bs, Ms, Mechanical Engineering