Dane A. Stanfield, Phd
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Dane A. Stanfield, Phd Email & Phone Number

Packaging R and D Engineer at Intel Corporation
Location: Beaverton, Oregon, United States 6 work roles 2 schools
1 work email found @intel.com 3 phones found area 360 LinkedIn matched
✓ Verified July 2026 4 data sources Profile completeness 100%

Contact Signals · 1 work email · 3 phones

Work email d****@intel.com
Direct phone (360) ***-****
LinkedIn Profile matched
3 free lookups remaining · No credit card
Current company
Intel Corporation
Role
Packaging R and D Engineer
Location
Beaverton, Oregon, United States
Company size
133841 employees

Who is Dane A. Stanfield, Phd? Overview

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Quick answer

Dane A. Stanfield, Phd is listed as Packaging R and D Engineer at Intel Corporation, a with 133841 employees, based in Beaverton, Oregon, United States. AeroLeads shows a work email signal at intel.com, phone signal with area code 360, and a matched LinkedIn profile for Dane A. Stanfield, Phd.

Dane A. Stanfield, Phd previously worked as Packaging R&D Engineer at Intel Corporation and Graduate Student Researcher at University Of California, Los Angeles. Dane A. Stanfield, Phd holds Doctor Of Philosophy - Phd, Materials Chemistry from University Of California, Los Angeles.

Company email context

Email format at Intel Corporation

This section adds company-level context without repeating Dane A. Stanfield, Phd's masked contact details.

*@intel.com
71% confidence

AeroLeads found 1 current-domain work email signal for Dane A. Stanfield, Phd. Compare company email patterns before reaching out.

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Profile bio

About Dane A. Stanfield, Phd

Dane A. Stanfield, Phd is a Packaging R and D Engineer at Intel Corporation. He possess expertise in surface chemistry, materials science.

Listed skills include Surface Chemistry and Materials Science.

Current workplace

Dane A. Stanfield, Phd's current company

Company context helps verify the profile and gives searchers a useful next step.

Intel Corporation
Intel Corporation
Packaging R and D Engineer
santa clara, california, united states
Website
intel.com
Employees
133841
AeroLeads page
Company profile
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6 roles

Dane A. Stanfield, Phd work experience

A career timeline built from the work history available for this profile.

R&D Engineer Intern

Intel Corporation

Hillsboro, Oregon, United States

Evaluating die singulation performance quality for the Singulation Module in Oregon Technology Development. Enabling the next generation of Si die packaging technologies to be scaled up to high volume manufacturing.

Jun 2020 - Aug 2020
Team & coworkers

Colleagues at Intel Corporation

Other employees you can reach at intel.com. View company contacts for 133841 employees →

MG Miya Gong Miya Gong Colleague at Intel CorporationChina View → DT Derrick Teoh Derrick Teoh Colleague at Intel CorporationButterworth, Penang, Malaysia View → NT Nhi Tran Nhi Tran Colleague at Intel CorporationGresham, Oregon, United States View → LT Lauren Tippets Lauren Tippets Colleague at Intel CorporationSan Francisco Bay Area, United States View → MS Mitchell Swyt Mitchell Swyt Colleague at Intel CorporationPortland, Oregon, United States View → GK Gal Kleinman Gal Kleinman Colleague at Intel CorporationIsrael View → BC Bo Chen Bo Chen Colleague at Intel CorporationHangzhou, Zhejiang, China View → TH Trevor Harcrow Trevor Harcrow Colleague at Intel CorporationTempe, Arizona, United States View → EK Eyal Kigel Eyal Kigel Colleague at Intel CorporationGan Yavne, Center District, Israel View → KC Krishnakali Chaudhuri Krishnakali Chaudhuri Colleague at Intel CorporationPortland, Oregon Metropolitan Area, United States View →
2 education records

Dane A. Stanfield, Phd education

Doctor Of Philosophy - Phd, Materials Chemistry

University Of California, Los Angeles

Thesis: Controlling Charge-Transfer Interactions in Doped Semiconducting Polymers and Directly Measuring Charge Carrier Localization.

FAQ

Frequently asked questions about Dane A. Stanfield, Phd

Quick answers generated from the profile data available on this page.

What company does Dane A. Stanfield, Phd work for?

Dane A. Stanfield, Phd works for Intel Corporation.

What is Dane A. Stanfield, Phd's role at Intel Corporation?

Dane A. Stanfield, Phd is listed as Packaging R and D Engineer at Intel Corporation.

What is Dane A. Stanfield, Phd's email address?

AeroLeads has found 1 work email signal at @intel.com for Dane A. Stanfield, Phd at Intel Corporation.

What is Dane A. Stanfield, Phd's phone number?

AeroLeads has found 3 phone signal(s) with area code 360 for Dane A. Stanfield, Phd at Intel Corporation.

Where is Dane A. Stanfield, Phd based?

Dane A. Stanfield, Phd is based in Beaverton, Oregon, United States while working with Intel Corporation.

What companies has Dane A. Stanfield, Phd worked for?

Dane A. Stanfield, Phd has worked for Intel Corporation, University Of California, Los Angeles, and Western Washington University.

Who are Dane A. Stanfield, Phd's colleagues at Intel Corporation?

Dane A. Stanfield, Phd's colleagues at Intel Corporation include Miya Gong, Derrick Teoh, Nhi Tran, Lauren Tippets, and Mitchell Swyt.

How can I contact Dane A. Stanfield, Phd?

You can use AeroLeads to view verified contact signals for Dane A. Stanfield, Phd at Intel Corporation, including work email, phone, and LinkedIn data when available.

What schools did Dane A. Stanfield, Phd attend?

Dane A. Stanfield, Phd holds Doctor Of Philosophy - Phd, Materials Chemistry from University Of California, Los Angeles.

What skills is Dane A. Stanfield, Phd known for?

Dane A. Stanfield, Phd is listed with skills including Surface Chemistry and Materials Science.

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