Daniel C. Email & Phone Number

Highly accomplished semiconductor/microelectronics industry veteran, with extensive experience in all aspects of IC packaging, including materials, quality, reliability, failure analysis, PCB design, development, and manufacturing. Multiple publications and patents. Currently retired, and enjoying it immensely!Specialties: • Semiconductor packaging materials and process development• Game console APU product thermal, mechanical, packaging, PCB, and reliability engineering• 1st (component) and 2nd (board) level interconnect reliability and solder joint metallurgy• Materials analysis and characterization including SEM, TEM, XPS, CSAM, Auger, FIB• Metrology and measurement systems characterization• Statistical methods and designed experiments: Six Sigma Black Belt• Subcontract manufacturing supplier management• RoHS and WEEE, environmental compliance