Daniel De Isla Puga Email & Phone Number

San Diego, California, US

Middleton, WI, US

Fort Collins, CO, US

Fort Collins, CO, US

Santa Cruz, CA, US

• Design, develop and evaluate packaging structures for the consumer market achieving cost, launch and scope goals successfully utilizing corrugated materials, SBS structures,Thermoforming, labels and Palletizing.
• Design of package structures for Plantronics M20, M50, M25, M55, Gamecom 380, Gamecom 780, Vpro HD products.
• Benchmark analysis of competition product packages for innovation of new packaging designs, materials and trends.
• Research on consumer feedback for influencing the package design aligning the design team continuous improvement efforts.
• Continuous improvement initiative leader implementing packaging peer reviews and design reviews in the early stages of the packaging development process agilizing product launch in the later stages of the design.
• Packaging design analysis and redesign for optimal performance in production and cost reduction.

• Lead multiple cost reduction/avoidance projects achieving over 1 Million dollars annually of savings: Redesign to reduce number of parts/ reduce cost of material and assembly Standardizing of materials for less cost.
• Cost analysis: Perform assembly process and scrap simulations for optimal design solutions.
• Introduction of New products implementing lean manufacturing and DFMA principles
• Sustainable improvements on production processes: Improvement on fixture design reducing assembly steps and time Optimization of line distribution  Change packaging process from UV to Ultrasonics ($60k dollar cost.
• Helped to implement the Design for excellence program world wide successfully with upper management aid.
• Provide DFMA training to colleagues from China, United States and Mexico achieving a company worldwide standard guideline for DFM.