Daniel Lai Email & Phone Number

California, United States

Cupertino, California, Us

Acoustic Module Manufacturing Design, Technical Program Management

Santa Clara, Ca, Us

• Manage Etch product line for new product release and NPI process, as the key focal person for reviewing all the technical and operational requirements to ensure smooth product transition from R&D to high volume manufacturing.• Develop cost model for operational cost analysis for new production systems, develop cost improvement roadmap, drive the engineering and business decisions and solutions for meeting the cost target.• Manage product forecast, budget, and product qualification planning. Work with planner and supply chain for the inventory planning for new product to ensure the supply on time to meet the future demand.• Lead program management for etch product line, lead the cross-functional team of Engineering, Field Service and Supplier management team to develop plan on improving production tool performance and drive the cost improvement solutions(ex: repair and refurb), work with the account management team to align on the commercial plan, managing development activities and the schedule to deliver the solution on time and to meet the program target.

• TPM in Technical marketing team for MEMS microphone and sensor product lines, owns product roadmap, marketing strategy and collateral, interfacing with customers to promote existing product & new design.• Lead program management for MEMS sensor projects from design kick-off to mass production.• Lead cross-functional team of Engineering, Manufacturing, Operation, Quality, and Supplier to deliver products on time. Plan all engineering builds, drive project schedules and deliverables from factory to meet customer requirement. Manage all changes to the product from NPI to Mass production.• Key technical contact and strategic account owner for Tier 1 OEMs (Amazon, Google.,etc) in NA market, including early engagement with commercial team, technical engagement with engineering team, evaluate the business case and develop resource plan to support the business opportunity, lead the team to penetrate into new market, win the new project opportunities and deliver new product solution to customers.

Fremont, Ca, Us

• In Etch product process R&D team responsible for process development and customer demo for Lam Etch systems includes conductor etching, metal and deep silicon etching for semiconductor IC fabrication and MEMS device fabrication (sensors, microphones…etc).• As the lead R&D engineer for the key process development program for new Piezo material etch, work with cross-functional team of ME and EE to define the hardware spec, lead the lab technicians to perform chamber upgrade including new hw integration and sw testing. Perform process development and validation on the latest hardware, successfully delivered the process result and drive the project from lab R&D to customer evaluation.• Developed a novel clamping/declamping method for insulator type ESC (Patent issued).

Fremont, Ca, Us

• As Sr. product engineer supporting R&D system development, new design validation and CIP, responsible for new product transition from lab to fab for all Legacy Etch products including both conductor & dielectric.• Manage customer escalation and support high-level system troubleshooting for worldwide customers and drive solution from factory to customer site.

Santa Clara, Ca, Us

- Silicon System Group • Support CMP and ECD products. Hands on working experience on tool installation and operation. In charge of Tier 0/Tier 1 startup, HW qualification plan, MTBF support and system retrofit.• Support worldwide products and manage customer site activities. Support critical long term customer issues and drive solution plan.• Work with engineering team to develop test methods and test new product design in engineering lab. Including chamber design and chemical delivery tank design. Develop FMEA (Failure Mode Effective Analysis) for new ECD system.

Master Of Science (Ms), Mechanical Engineering

Bachelor Of Science (Bs), Engineering