Sr Pcb Designer
Current
Dec 2021 - Present
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Daniel Lepage Email & Phone Number
PCB Board Designer ► Cadence Allegro | Gerber Outputs | Layout | Trouble Shooting | Documentation
at
Solidigm
3 work emails found
@intel.com
2 phones found area 408
LinkedIn matched
✓ Verified May 2026
4 data sources
Profile completeness 100%
Current company
Role
PCB Board Designer ► Cadence Allegro | Gerber Outputs | Layout | Trouble Shooting | Documentation
Location
Greater Sacramento, United States, United States
Who is Daniel Lepage? Overview
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Quick answer
Daniel Lepage is listed as PCB Board Designer ► Cadence Allegro | Gerber Outputs | Layout | Trouble Shooting | Documentation at Solidigm, based in Greater Sacramento, United States, United States. AeroLeads shows a work email signal at intel.com, phone signal with area code 408, and a matched LinkedIn profile for Daniel Lepage.
Daniel Lepage previously worked as SR PCB Designer at Solidigm and SR PCB Designer at Intel Corporation. Daniel Lepage holds On The Job Taining 32 Years With Intel Working On Hardware Teams, Computer Hardware Engineering from Intel Corp.
Company email context
Email format at Solidigm
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{first_initial}{last}@intel.com
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AeroLeads found 3 current-domain work email signals for Daniel Lepage. Compare company email patterns before reaching out.
Profile bio
About Daniel Lepage
Focused hard working individual, great communicator able to work alone or on a team. I am a team player, willing to help/mentor team members. I have worked on large server projects that take months to complete to small designs taking 1 day. Coordinating projects with peers and external vender's has been a common practice for me.Internet of Things Group- PCB Layout - small compact HDI designs wide variety. Mobile Communications Group, PCB Layout Cell phones, Modem cards Tablets, test cards Intel Validation Hardware Folsom- Server & Desk top mother boardsAREAS OF EXPERTISE• Cadence Allegro 16.6 - 17.X• Detailed Quality Designs • Crisis Management• Cross-site Collaboration• CAD Vender management • Resolves Design Issues • Oversee all Phases of Projects• Excellent Communication Skills• Participates in Design Evolution• Gerber outputs 274X, ODB++• Project Management• Team Leadership• Focus under pressure• Project Status Reports• Knowledgeable on StandardsI am Known for my attention to detail and getting this done right the first time.I am known for having no PCB design issues on my boards, no fabrication issuesI've had the privilege of being on Intel hardware teams working with some of top design engineers in the company our team was know for getting the schematics and board done right the first time "no fab spins" we strived for perfection saving Intel time and money.I work closely with Fab venders to be sure there are no DFM issues, Valor was run on our boards in house then the fab house would run their DFM checks. Through this process we insured a successfulfab each and every time.I have completed hundreds of board designs for hardware teams at Intel from start to finish. Hardware is a team effort each team member working closely with his or her peer towards a common project goal.
Listed skills include Semiconductors, Embedded Systems, Debugging, Electronics, and 31 others.
Current workplace
Daniel Lepage's current company
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5 roles
Daniel Lepage work experience
A career timeline built from the work history available for this profile.
Sr Pcb Designer
Jul 2021 - Dec 2021
Board Design Engineer
High Speed PCB Design doing Client motherboards, Server motherboards, Cell Phone, Tablets, Add-on boards, Test cards, Project management, managing external venders, Fab outputs, communicating with fab houses, IOTG Internet of Things all kinds of custom designs for Intel customers.experience with; GND return path via stitchingswitching power supply.
Jun 1996 - Oct 2016
Sr Engineering Technition
Supported large team 15+ Design Engineers inside the lab. Performed trouble shooting and repair of motherboards, add-in cards, power supplies - which included soldering and de-soldering components, installing and removing BGA devices using SRT machine. Use of test equipment, creating reports and tracking data for analysis.
Apr 1990 - May 1996
Electro Mechanical Technician
Electro-mechanical Tech inside Intel's Fab3 In Livermore Calif. Worked in the Lithography section of the wafer fab. Performed maintenance and repair of state of the art fab equipment in Litho. Specializing in Ultra-Tech steppers, SSI coaters, GCA developers, Perk & Elemer printers, OSI inspection stations. This equipment dealt with Lasers, stepper-motors.
Sep 1984 - Apr 1990
3 education records
Daniel Lepage education
On The Job Taining 32 Years With Intel Working On Hardware Teams, Computer Hardware Engineering
Intel Corp
Associate’S Degree, Electromechanical Engineering, A
High School Diploma, Electronics, A
Pleasant Hill High School
FAQ
Frequently asked questions about Daniel Lepage
Quick answers generated from the profile data available on this page.
What company does Daniel Lepage work for?
Daniel Lepage works for Solidigm.
What is Daniel Lepage's role at Solidigm?
Daniel Lepage is listed as PCB Board Designer ► Cadence Allegro | Gerber Outputs | Layout | Trouble Shooting | Documentation at Solidigm.
What is Daniel Lepage's email address?
AeroLeads has found 3 work email signals at @intel.com for Daniel Lepage at Solidigm.
What is Daniel Lepage's phone number?
AeroLeads has found 2 phone signal(s) with area code 408 for Daniel Lepage at Solidigm.
Where is Daniel Lepage based?
Daniel Lepage is based in Greater Sacramento, United States, United States while working with Solidigm.
What companies has Daniel Lepage worked for?
Daniel Lepage has worked for Solidigm, Intel Corporation, and Intel.
How can I contact Daniel Lepage?
You can use AeroLeads to view verified contact signals for Daniel Lepage at Solidigm, including work email, phone, and LinkedIn data when available.
What schools did Daniel Lepage attend?
Daniel Lepage holds On The Job Taining 32 Years With Intel Working On Hardware Teams, Computer Hardware Engineering from Intel Corp.
What skills is Daniel Lepage known for?
Daniel Lepage is listed with skills including Semiconductors, Embedded Systems, Debugging, Electronics, Testing, Soc, Mechanical, and Trouble Shooting.
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