Daniel Lorek
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Daniel Lorek Email & Phone Number

Sr. Payload Integration and Test Communications System Engineer at Amazon
Location: Redmond, Washington, United States 13 work roles 1 school
1 work email found @intel.com LinkedIn matched
✓ Verified May 2026 4 data sources Profile completeness 100%

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Work email d****@intel.com
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Current company
Role
Sr. Payload Integration and Test Communications System Engineer
Location
Redmond, Washington, United States
Company size

Who is Daniel Lorek? Overview

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Daniel Lorek is listed as Sr. Payload Integration and Test Communications System Engineer at Amazon, a company with 734811 employees, based in Redmond, Washington, United States. AeroLeads shows a work email signal at intel.com and a matched LinkedIn profile for Daniel Lorek.

Daniel Lorek previously worked as Sr. Payload Integration & Test Communications System Engineer at Amazon and RF System Integration and Validation Engineer at Apple. Daniel Lorek holds Electronics Engineering Technology from Itt Technical Institute.

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Email format at Amazon

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{first}.{last}@intel.com
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Profile bio

About Daniel Lorek

A team-oriented and highly motivated Engineer with 20+ years direct experience in RF/mixed signal testing in ATE, PXI, and Rack and Stack environments. Energetic self-starter with excellent analytical, organizational, and creative skills. Certified LabVIEW Developer (CLD) - 08/2014

Listed skills include Rf, Ic, Semiconductors, Mixed Signal, and 23 others.

Current workplace

Daniel Lorek's current company

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Amazon
Amazon
Sr. Payload Integration and Test Communications System Engineer
Redmond, WA, US
Website
Employees
734811
AeroLeads page
13 roles

Daniel Lorek work experience

A career timeline built from the work history available for this profile.

Sr. Payload Integration And Test Communications System Engineer

Redmond, WA, US

Sr. Payload Integration & Test Communications System Engineer

Current

Seattle, WA, US

Nov 2022 - Present

Rf System Integration And Validation Engineer

Cupertino, California, US

Apple acquired Intel's smartphone modem business unit in 2019.

Dec 2019 - Aug 2022

Rf System Integration And Validation Engineer

Santa Clara, California, US

Responsible for the bring-up, verification, and debugging of RF subsystems in 4G/5G NR modem applications consisting of RF Transceivers, Power Management, and PAs. This required coordinated debugging efforts with cross functional teams such as System Engineering, Firmware, System Integration, Baseband, and external customers. Experienced with providing.

Nov 2014 - Dec 2019

Senior Rf Test Automation Engineer

Hillsboro, OR, US

Tasked with supporting TriQuint’s worldwide Applications Engineering group for the Mobile Devices Business Unit. This included the test and characterization of high frequency modules (PAs, switches, and passives) for the mobile communications market including GSM/EDGE, CDMA, LTE, and WLAN products. Responsible for the development of tools to control and.

Nov 2011 - Oct 2014

Senior Rf Test Engineer (Contractor)

Beaverton, OR, US

As a member of the New Product Introduction Team, I was responsible for creating both hardware and software for the characterization and production testing of Tektronix’s next generation Real Time Spectrum Analyzers operating up to 20GHz utilizing National Instruments’ TestStand test management software along with LabVIEW's graphical programming environment.

Jan 2011 - Nov 2011

Senior Test Engineer

Camarillo, CA, US

Designed, developed, and documented test procedures for the testing of high speed 10/40 Gb/s SERDES devices from a product design phase through production.Debugged and resolved real-time manufacturing, customer return, and design application issues as required.Consistently communicated technical product status to management and ensured product quality.

Jan 2010 - Apr 2010

Senior Test Engineer

US

Sierra Monolithics was acquired by Semtech in January, 2010.

Apr 2009 - Jan 2010

Senior Test Engineer

US

Worked closely with Design Engineering to create a solution to fully characterize Staccato’s single-chip 65nm CMOS Ultra-Wideband (3-10GHz) SOC across PVT utilizing Rack and Stack equipment and Teradyne’s Integraflex ATE software (VB) running in offline mode. This allowed the seamless transition of the device to the tester platform for large-scale.

Nov 2006 - Apr 2009

Senior Support Engineer

San Diego, CA, US

Responsible for the development and on-time release of multi-site RFIC production solutions on the Teradyne IntegraFlex ATE for CDMA transmitter and a CDMA/GSM transceiver. This included DIB design, software development, and successful correlation and transfer to offshore test facilities in Asia.Qualcomm’s first RF ATE Engineer chosen to be trained on the.

Mar 2004 - Nov 2006

Test Engineer

US

Designed hardware and software for the characterization and production testing of RFIC semiconductor products for markets including consumer broadband wireless, digital terrestrial and satellite TV on the Agilent 84000 tester.Created lab ATE software to characterize multiple devices using LabView and common RF lab equipment programmed via.

Jun 2002 - Mar 2004

Test Engineer

Ensemble Communications

Designed Agilent (HP) VEE and Visual Basic based control and test software for the characterization of high frequency (24 GHz to 40 GHz) LMDS radios. Data collected was presented in Excel and stored in Access via ActiveX Automation.Designed and debugged RF hardware for LMDS radios. Made component changes to and troubleshot circuitry including amplification.

Jun 1999 - Jun 2002

Technician Specialist

US

Tested, tuned, troubleshot, and made modifications to: amplifiers, up/down converters, multipliers, switches, and numerous other RF/Microwave components. Performed common measurements such as IP3, noise figure, and phase noise on a daily basis.Created documentation on procedures for testing, tuning, and debugging hardware so that it could be effectively.

Jan 1997 - Jun 1999
Team & coworkers

Colleagues at Amazon

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1 education record

Daniel Lorek education

  • Itt Technical Institute
    Itt Technical Institute
    Electronics Engineering Technology
FAQ

Frequently asked questions about Daniel Lorek

Quick answers generated from the profile data available on this page.

What company does Daniel Lorek work for?

Daniel Lorek works for Amazon.

What is Daniel Lorek's role at Amazon?

Daniel Lorek is listed as Sr. Payload Integration and Test Communications System Engineer at Amazon.

What is Daniel Lorek's email address?

AeroLeads has found 1 work email signal at @intel.com for Daniel Lorek at Amazon.

Where is Daniel Lorek based?

Daniel Lorek is based in Redmond, Washington, United States while working with Amazon.

What companies has Daniel Lorek worked for?

Daniel Lorek has worked for Amazon, Apple, Intel Corporation, Triquint Semiconductor (Now Qorvo, Inc.), and Tektronix.

Who are Daniel Lorek's colleagues at Amazon?

Daniel Lorek's colleagues at Amazon include Reidokdang Dokdang, Gaurav Mohanty, Troy Avila, Susan Stockman, and Lonette Lowe.

How can I contact Daniel Lorek?

You can use AeroLeads to view verified contact signals for Daniel Lorek at Amazon, including work email, phone, and LinkedIn data when available.

What schools did Daniel Lorek attend?

Daniel Lorek holds Electronics Engineering Technology from Itt Technical Institute.

What skills is Daniel Lorek known for?

Daniel Lorek is listed with skills including Rf, Ic, Semiconductors, Mixed Signal, Analog, Test Engineering, Spectrum Analyzer, and Debugging.

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