Yield, Bin Split And Phi Engineer
CurrentWork on Product Development and Product Health Indicators of most advanced generation of Intel microprocessors and SoC
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Daniel Miller is listed as Yield, Bin Split and PHI Engineer at Intel Corporation at Intel Corporation, a with 133841 employees, based in Israel. AeroLeads shows a work email signal at intel.com and a matched LinkedIn profile for Daniel Miller.
Daniel Miller previously worked as Yield, Bin Split and PHI Engineer at Intel Corporation and Staff R&D engineer at Intel. Daniel Miller holds Phd, Physics from The Hebrew University Of Jerusalem.
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AeroLeads found 1 current-domain work email signal for Daniel Miller. Compare company email patterns before reaching out.
Experience with semiconductor device engineering, optimization, meeting performance and reliability goals.Specialties: JEDEC and memory components reliability, Statistical Data Analysis, Device vs process simulations (Sentaurus,Supreme, Dessis), test structures design (Cadence, Tanner, Silvaco), experiment setup (DOE), automatic (ETEST) and manual (Cascade Station) testing, design rule development and validation, mask synthesis flow, circuit modeling and models of circuit elements (SPICE).
Listed skills include Innovation, Model Based Problem Solving, Great Communications Skills, Statistical Data Analysis, and 25 others.
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Idc Haifa
Work on Product Development and Product Health Indicators of most advanced generation of Intel microprocessors and SoC
Qiryat Gat, Israel
Technology R&D of Si-Photonics Optic communication devices
Qiryat Gat, Israel
Process R&D for Photonically Optimized Embedded Microprocessors (POEM) in collaboration with MIT (Boston, MA); responsible for process development and electrical testing of all on-chip elements necessary for optical communication; the performance of the CMOS micro-controller is thoroughly preserved.
45 nm Nor Flash and Cmos R&DAll device related R&D work: device targeting, opening device parametric windows by process optimization, extrinsic and intrinsic reliability, developing algorithms for screening flash cells. From one healthy cell per wafer in 2008 to one defective cell per wafer in 2012
45nm CMOS/FLASH R&DTechnology pick-up. Great experience with the team work in multi-site and multi-country enviroment.
Made devices for 1.0/0.7/0.4/0.09/0.065/0.045 umCMOS/FLASH/EPROM/MEMS technologies
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Raghava Maroju
Colleague at Intel CorporationHyderabad, Telangana, India
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Dibyajyoti Mohanty
Colleague at Intel CorporationHillsboro, Oregon, United States
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Zachary Rice
Colleague at Intel CorporationSan Francisco, California, United States
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Priya C
Colleague at Intel CorporationBengaluru, Karnataka, India
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Slava Isaev
Colleague at Intel CorporationRussia, Russian Federation
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Adérito Cardoso
Colleague at Intel CorporationChandler, Arizona, United States
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Rajat Kumar
Colleague at Intel CorporationBengaluru, Karnataka, India
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Yitzchak Katz
Colleague at Intel CorporationNorth District, Israel
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Amit Ben-Zvi
Colleague at Intel CorporationCalifornia, United States
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William Wang
Colleague at Intel CorporationSan Jose, California, United States
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PhD focus was on the vertical transport in semiconductor superlattices
Quick answers generated from the profile data available on this page.
Daniel Miller works for Intel Corporation.
Daniel Miller is listed as Yield, Bin Split and PHI Engineer at Intel Corporation at Intel Corporation.
AeroLeads has found 1 work email signal at @intel.com for Daniel Miller at Intel Corporation.
Daniel Miller is based in Israel while working with Intel Corporation.
Daniel Miller has worked for Intel Corporation, Intel, Micron Technology, Numonyx, and The Weizmann Institute Of Science.
Daniel Miller's colleagues at Intel Corporation include Raghava Maroju, Dibyajyoti Mohanty, Zachary Rice, Priya C, and Slava Isaev.
You can use AeroLeads to view verified contact signals for Daniel Miller at Intel Corporation, including work email, phone, and LinkedIn data when available.
Daniel Miller holds Phd, Physics from The Hebrew University Of Jerusalem.
Daniel Miller is listed with skills including Innovation, Model Based Problem Solving, Great Communications Skills, Statistical Data Analysis, Design Of Experiments, Device Characterization, Process Integration, and Strong Background In The Condensed Matter Physics.
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