Daniel Sargent Email and Phone Number

Fostering teamwork across divisions and functions to eliminate barriers and maximize speed to delivery of next generation consumer electronic smart wearables. Enabling the creation of a new product segment through the creation of high-volume high performance truly wireless in ear headphones with augmented reality sensors. Ensuring business and market viability through careful management of program and product costs while championing differentiating features to promote market acceptance. Maximizing company success by sharing lessons learned, design critiques and influencing future product definitions. • Drive program development with focus on schedule, cost, scope and market viability• Capitalize on opportunities for product and program cost reductions pre and post launch• Foster teamwork in global cross-functional teams: hardware, software, quality, supply chain, marketing, etc.• Guide category roadmap decisions through targeted feasibility studies and analysis• Minimize program risks by gaining alignment for redundant flexible mitigation plans• Advise stakeholders at regular intervals on program status

Executed the technical design, risk mitigation, manufacturing process development and post launch response activities through inclusive system level approach. Employed industry best practices including Lean six-sigma, DFMEA, PFMEA and Speed of Trust tools.• Directed all technical aspects of the consumer electronics product development team• Ensured alignment between marketing vision and technical deliverables throughout development• Orchestrated down selections and tradeoff discussions towards robust manufacturable designs• Facilitated design reviews and feedback integration throughout development• Led rapid response teams after product launch to address field issues

Applied advanced analytic and modeling technologies to design best in class acoustic performance on passive and active headsets. Acoustic packages included in-ear, on-ear and around-ear designs for consumer grade headphones and earbuds.• Designed and selected acoustic components for consumer headsets including microphones, drivers, ports, cavities and resistive elements• Simulated, prototyped and measured acoustic performance characteristics of headphones• Developed and implemented production acoustic test fixtures and processes• Validated manufacturing, test and process variability through product launch

Within the growing MEMS microphone division, headed the development of next generation sensor elements from wafer fabrication to product integration. Developed and launched the first three products using the new elements while validating and qualifying dual source packaging and test facilities to support mass production. Provided hands on analysis at cutting edge smart phone manufacturer factory to ensure on time production ramp. • Coordinated characterization, qualification and release to production of MEMS microphone products• Led multi-disciplinary teams: design, marketing, applications, test and quality engineering groups• Developed bench test capabilities for new and existing microphone products• Evaluated and debug first silicon for logic circuits and sensor elements• Optimized production yields and performance through statistical analyses and root cause analysis

- Perform analysis of returned Micro Electro-Mechanical Systems (MEMS) - Utilize state-of-the-art product analysis techniques to identify physical defects and determine root cause (See Skills section for a detailed list of competencies)- De-process silicon devices using chemical, plasma and mechanical methods- Publish findings of analyses in reports for customers and internal engineering staffINTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS, San Jose, CA Nov. 2007Analog Building Blocks: Circuits and Devices- Authored and presented one hour tutorial to the 33rd annual ISTFA Conference and Exposition