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Daniel Tiscareño Email & Phone Number

Engineering Manager | Semiconductors, Optics & Electronics
Location: Guadalajara, Mexico Metropolitan Area, Mexico 6 work roles 2 schools
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Role
Engineering Manager | Semiconductors, Optics & Electronics
Location
Guadalajara, Mexico Metropolitan Area, Mexico

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Daniel Tiscareño is listed as Engineering Manager | Semiconductors, Optics & Electronics based in Guadalajara, Mexico Metropolitan Area, Mexico. AeroLeads shows a matched LinkedIn profile for Daniel Tiscareño.

Daniel Tiscareño previously worked as Engineering Manager at Jabil and Department Manager of IC Assembly Engineering, Cost & Automation at Texas Instruments. Daniel Tiscareño holds Bachelor'S Degree, Mechatronics from Universidad Politécnica De Aguascalientes.

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About Daniel Tiscareño

As Engineering Manager, I spearhead a team dedicated to advancing manufacturing processes within ISO-certified cleanroom operations. Our focus on Lean Six Sigma methodologies and cost reduction strategies has markedly enhanced efficiency and reliability, particularly in complex SMT, Chip on Board and other complex Semiconductors manufacturing processes.With my educational foundation in Mechatronics, I integrate theoretical knowledge with practical experience. This synergy fosters new product introductions and direct interaction with customers, ensuring our engineering solutions align with dynamic market demands and high-quality standards.

6 roles

Daniel Tiscareño work experience

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Engineering Manager

Guadalajara, Mexico Metropolitan Area

o Manager of engineering department (Industrial, Automation, Test, Product and Mfg. Engineering).o Optics: Automotive Camera, NPI, DFX, Manufacturing Process & Reliability.o Data Analytics (Tibco Spotfire, Power Bi, SQL).o SMT, Chip on Board (COB), Top & Bottom Assembly, Optical Test (Active Alignment and EOL, MTF Test).o Management of ISO 5,7 & 8 Clean Room operations.o Lean Six Sigma & Cost Reduction.o Direct Interaction with Customer and Design Eng.

Nov 2023 - Nov 2024

Department Manager Of Ic Assembly Engineering, Cost & Automation

Aguascalientes, Mexico

o Manager of Section managers from FOL (Dicing, Die Attach and Wirebond), EOL (Molding, Symbol, trim and form) & Factory Automation Department.o Manage headcount and department budget.o New Technology & Process Introduction.o Site capacity growth and facility expansion: Capacity Model, Manufacturing Layout (design 10-50k particle clean room), Equipment definition, process flow and technical headcount forecast. o CapEx design and submission for capacity increase, automation strategies and quality improvements.o Mentor of Senior Engineers for Technical ladder career path. Achievements: Key enabler for 30% Site capacity growth due to market demand increase.

Aug 2022 - Oct 2023

Ic Assembly Process & Equipment Manager

Mexico

o Process and Equipment leadership of Assembly front of line (back grind, wafer dicing, die attach and wire bond).o 300mm wafer production line introduction for TMEX. o Human, technologic and financial resources management aimed to KPI continuous improvement. o SCP (Semiconductors Packaging) Support for New Technologies Implementation, includes experimental learning cycles, full characterization process, DOE development and reliability, qualification and RTP.Achievements: Elected as Member Group Technical Staff (MGTS) as recognition for excellence in technical contributions.

Jan 2019 - Aug 2022

Wirebond Engineering Supervisor

Mexico

o Technical Staff Management: individual performance, skills development and healthy work environment. o Preventive, Corrective and Predictive Maintenance responsible.o KPI tracking and continuous improvement: PM on time, MTBA, OEU, hard downtime and set up success rate. o Sponsorship for WB technical staff at multiple Technical Symposium (Presentation Skills, Data facilitator, benefits /saving validation).

May 2018 - Jan 2019

Ic Wirebond Assembly Engineer

Mexico

o Day-to-Day technical support in production floor, (Downtime process related & suspect material disposition).o Qualification of direct and indirect materials driven by quality and cost improvements.o Re-design of wirebond manufacturing processes aimed to increase process capability, yield loss and tool stability. o Small signals and early detection systems implementation (error proofing concept) for WB recipe management. o Problem solving methodology for chronical/ day-to-day issues (FTA/PDCA/DMAIC).Achievements: 1st Prize 2017 Mexico& Asia 5S Convention (Baguio, Philippines) “WB Tool Stability Improvement, 30% OEU & MTBA, +10% Operation Output, Headcount Productivity US$4.4M Est Revenue.

Sep 2016 - Apr 2018

Engineering Intern

Mexico

o Full automated and error proofing system implementation to avoid undesired changes or wrong bonding.o Identification, depuration and quality certification of full catalogue of +2000 wire bond recipes.

Mar 2015 - Sep 2016
2 education records

Daniel Tiscareño education

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What is Daniel Tiscareño's role at their current company?

Daniel Tiscareño is listed as Engineering Manager | Semiconductors, Optics & Electronics.

Where is Daniel Tiscareño based?

Daniel Tiscareño is based in Guadalajara, Mexico Metropolitan Area, Mexico.

What companies has Daniel Tiscareño worked for?

Daniel Tiscareño has worked for Jabil and Texas Instruments.

How can I contact Daniel Tiscareño?

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What schools did Daniel Tiscareño attend?

Daniel Tiscareño holds Bachelor'S Degree, Mechatronics from Universidad Politécnica De Aguascalientes.

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