• Managed new product introduction (NPI) from quote to full scale manufacturing for multipleconcurrent Printed Circuit Board Assembly (PCBA) and mechanical sub assembly projects. • Directed multidisciplinary team on all aspects of NPI including design, procurement, manufacturing,and test. • Successfully lead a virtual team of design, test, and manufacturing engineers from customer productrefinement through production in under 6 months. • Facilitated communications between all stakeholders while balancing needs.

• Managed all engineering activities for new products introduction and early user hardware. • Developed electronics assembly processes including wave solder, solder fountain rework, SMT reflow, and characterization for new products. • Performed process development, testing, and characterization for new products.• Utilized designed experiments analysis of variance, gage R&R studies, and process capability studies in process improvement and new product development.

•Designed new assembly equipment for improved thermal performance•Analyzed new designs using finite-element analysis•Verified FEA results on actual equipment with strain and temperature analysis

•Developed and implemented a kanban and heijunka system for stamping processes•Participated in Kaizen events including the redesign of a lock assembly line to reduce motion waste•Created floor plans and assisted in logistics of changing factory layout to improve flow of material and goods