Independent Director And Remuneration Committee Member
CurrentBusiness operation review and oversight; Contigent plan review on critical business plan
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Daniel Hao-Tien Lee is listed as Independent Director and Remuneration Committee Member at Bison Electronics. Inc., based in Taiwan, Province of China. AeroLeads shows a matched LinkedIn profile for Daniel Hao-Tien Lee.
Daniel Hao-Tien Lee previously worked as Board Supervisor at Mutual-Pak Technology Co., Ltd. (Rfid And Csp Packaging Solution Providers) and Adjunct Assoicate Professor at Global Business Program, School Of Business, Soochow University. Daniel Hao-Tien Lee holds Ph.D, Polymer Science Program, Institute Of Material Science from University Of Connecticut.
Daniel Hao-Tien Lee has been working mostly in the technology startups in the IT industry for more than 25 years including semiconductor R&D and production, IC product design , and product and technology innovation. He worked with firms which operation located in UK, US, Germany, and Taiwan. Daniel Lee has been acting as board member, investor, and observer for over 20 venture startups. He was previously involved in the formation of four venture firms including Vanguard International Semiconductor Corp., Pacific Semiconductor Manufacturing Corp., Pixelfusion Inc. and ETOMS. Daniel Lee had global operation and engineering development management experience with firms such as Pixelfusion Inc. (now as ClearSpeed, UK) and Siemens(Memory Division, Germany), and had marketing, business, financial development and engineering management experience with ETOMS as well as technology innovation development experience in ERSO/ITRI-Taiwan. Daniel Lee has consultant experience in photo-sharing service and IoT solution provider and has board member experience in early startup, pre-IPO and IPO public companies.Daniel Lee also had teaching and lecturing experience in various universities such as Chung Yuan Christian University, Submic-EE of National Chiao Tung University, and TCFST of National Tsing Hwa University. He has been adjunct associate professor in the Global Business Program of Business School, Soochow University since 2010. As a continuous learner and problem solver, he has been actively involved in Kaggle Data Science Competition https://www.kaggle.com/danieleewww since 2015.Daniel holds a Ph.D from University of Connecticut, M.S. from University of Utah, and B.S. from Chung-Yuan Christian University.Daniel had experience in the intensive home-care activities for fully paralyzed patient in the past and http:\\homecare20e.synthasite.com was his social sharing on this.
Listed skills include Product Development, R&D, Venture Capital, Start Ups, and 8 others.
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3F, 28, Ln.583, Rueiguang Rd, Neihu District, Taipei, Taiwan
Business operation review and oversight; Contigent plan review on critical business plan
No.2, Songjiang N. Rd., Jhongli Industrial Park, Taoyuan County 320,
Business strategy
Taipei City, Taiwan
http://danieleewww.yolasite.com/mgb070-course-of-soochow-u.php
http://www.linkedin.com/myprofile?locale=en_US
Activities and Societies: Tau Beta Pi, APS, ACS
Activities and Societies: School Basketball Team (1974)
Activities and Societies: School Basketball Team
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Daniel Hao-Tien Lee works for Bison Electronics. Inc..
Daniel Hao-Tien Lee is listed as Independent Director and Remuneration Committee Member at Bison Electronics. Inc..
Daniel Hao-Tien Lee is based in Taiwan, Province of China while working with Bison Electronics. Inc..
Daniel Hao-Tien Lee has worked for Bison Electronics. Inc., Mutual-Pak Technology Co., Ltd. (Rfid And Csp Packaging Solution Providers), Global Business Program, School Of Business, Soochow University, Etoms Electronics Corp., and National Tsing Hua University, Tcfst.
You can use AeroLeads to view verified contact signals for Daniel Hao-Tien Lee at Bison Electronics. Inc., including work email, phone, and LinkedIn data when available.
Daniel Hao-Tien Lee holds Ph.D, Polymer Science Program, Institute Of Material Science from University Of Connecticut.
Daniel Hao-Tien Lee is listed with skills including Product Development, R&D, Venture Capital, Start Ups, Entrepreneurship, Software Development, Semiconductors, and Business Analysis.
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