Daniel Holmes Email & Phone Number

Boston, Ma, Us

Bedford, Ma, Us

Leading R&D and new product development of precision optical encoder products and solutions for medical devices, life sciences, advanced robotics, semiconductor and industrial markets. Key contributor for cross-functional continuous improvement efforts to meet the needs of ISO 13485.• Scope, plan, staff, and direct R&D activities for NPI, NTD, and custom OEM products for $60M business unit.• Develop and manage road maps and align resources, CAPEX, and AOP with a five-year strategic plan.• Perform project management of VAVE and sustaining initiatives, expanding gross margin by 30% for important accessories and tools, and reducing the R&D sustaining load from as high as 50%, down to 20%.• Engaged in cross-functional Kaizen and continuous improvement projects to develop a vendor transfer process, and a component obsolescence process, providing insight for execution of a 3-5 year product line sustaining roadmap.• Work closely with global ISO 13485 and ISO 9001 manufacturing partners, from prototype to full rate production.• Participated in FMEA’s, with cross-functional teams and manufacturing partners, to assure reliability and DFM/DFT of complex product assemblies with various technologies (SMT, Chip on Board, ASIC, opto-mechanical assemblies, etc.).

• Actively engaged in the development and pursuit of new business opportunities resulting in design wins in manufacturing, defense, health care, and commercial applications.• Collaborated with VARs, and strategic partners, and gathered the voice of the customer (VOC), to understand market needs and define differentiating features for advanced technology projects.• Implemented commercial strategies for a wearable visual-inertial sensor (IS-1500) running embedded SLAM/VINS algorithms, targeting navigation and AR situational awareness in GPS-denied environments.• Project management lead for the HObIT “Hybrid Optical-based Inertial Tracker”, used in the Thales Scorpion helmet mounted display system, enabling $12M of A-10 and F-16 contracts during the first year of release.• Managed the integration of InterSense’s product data into Windchill PLM system after being acquired by Thales.• Led team reorganization and drafted operational process improvements to comply with Thales’ AS9100 QMS including configuration management manual, systems engineering manual, and change management processes.

Billerica, Ma, Us

• Responsible for company-wide Product Development, Engineering Services, and Program Management.• Contributed to Business Development initiatives including, requirements gathering, scoping, planning, budgeting, SOW creation, and Project/Program Management.• Oversaw the release of multiple high performance MEMS inertial sensors, Optical sensors, ultrasonic sensors, and embedded platforms utilizing Linux, Android and proprietary RTOS software.• Led R&D and Technical Support staff, developing high-performance position measurement sensors (MEMS-based 3DOF IMU and 6DOF optical/acoustic-inertial), for industrial, defense, healthcare, and commercial applications.• Provided hands-on support of Business Development initiatives for customer and government funded (SBIR and BAA) activities including requirements gathering, scoping, budgeting, and SOW creation.• Acted as project/program manager for Phase 1/Phase 2 NASA SBIR leading to > $1M of contract revenue. • Contributed to the due diligence initiatives during the sale of InterSense to Thales.

Burlington, Ma, Us

• Management of FPGA, systems design, and project engineers developing broadcast audio/video editing and server products.• Led local and remote multidisciplinary project teams through several new product introductions including “Airspeed” video ingest/playback server, and “Adrenaline HD”, a broadcast-quality digital host interface platform.

• Directed a staff consisting of hardware, firmware, FPGA, ASIC, CAD, and NPI Engineers developing audio/video editing, processing, and compression products and technologies.• Project Manager for 3 separate ASIC devices and multiple PCB assemblies for the Media 100 844/X video editing and effects system.