Daniel Mendoza

Daniel Mendoza Email and Phone Number

Distinguished Member of Technical Staff @ Draper
Cambridge, MA, US
Daniel Mendoza's Location
Greater Boston, United States, United States
Daniel Mendoza's Contact Details

Daniel Mendoza work email

Daniel Mendoza personal email

About Daniel Mendoza

Semiconductors Packaging Dev. /Process Development and OptimizationUS Patents USD576968, USD606021 and USD603352. Used in the first LED based projection TV, Data projectors and Entertainment illumination.Multiple product development and designs have been held as trade secrets or classified to prevent public disclosureProduct design and development, project management certification, R&D, process re-engineering and optimization to meet yields, cost targets or performance in industries requiring state of the art packaging (RF, LED lighting/Projection, High Power, Wireless Signal, Medical, Consumer Applications)Other technologies include Microwave assemblies, High performance infrared FPAs and Medical electronicsLean manufacturing implementation and leadership experience with Value stream Mapping training through WPI to reduce wastes (overproduction, excess inventories, material movement, excessive motion, waiting, defects, excessive processing steps, and the under-utilization of your resources. Developed extensive expertise in heavy (5 to 20 mils) and small (1 to 3 mils) Aluminum/Gold wire bonding yield improvement to improve performance and device reliability/mechanical lifespan.Developed expertise in gold wire ball bonding/Wedge bonding by fully optimizing the process looking at each variable and their interactions.Introduced "Vacuum Die Attach Technology" to reduce solder die attach voiding from 15% to <1% while improving VSD performance.Active black belt leader in the optimization and manufacturing cost reduction of IGBT modules and IGBT gate driver modules.Extensive expertise in modern materials science (alloys, silicone and adhesives) to improve mechanical, thermal performance.Specialties: Applied statistics, loss function and orthogonal experiments in manufacturing processes/development to reduce variation of a product / process while improving throughput and reduce cost to achieve efficiency (LEAN). Processes include (not limited to) Die Attach, Adhesive Selections, Wire Bonding, Hermetic Seal, SMT, Thermal Performance Designs.

Daniel Mendoza's Current Company Details
Draper

Draper

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Distinguished Member of Technical Staff
Cambridge, MA, US
Website:
draper.com
Employees:
2675
Daniel Mendoza Work Experience Details
  • Draper
    Draper
    Cambridge, Ma, Us
  • Draper
    Distinguished Member Of Technical Staff
    Draper Mar 2024 - Present
    Cambridge, Ma, Us
    As a nonprofit research and development company, Draper focuses on the design, development, and deployment of advanced technological solutions for the world’s most challenging and important problems.Previously, the Front-End, Back-End semiconductor packaging and SMT Engineers operated separately due to technology differences and skills. As an Advanced Packaging Engineer, it is my responsibility to overlap these techniques and meet the exploding demand for ultra-compact, sophisticated SMT capable, Advance Packaging Solution assemblies.
  • Bae Systems, Inc.
    Technical Operations Engineering Manager
    Bae Systems, Inc. Mar 2014 - Mar 2024
    Falls Church, Virginia, Us
  • Infineon Technologies
    Packaging And Process Development Engineer
    Infineon Technologies Mar 2010 - Mar 2014
    Neubiberg, München, De
  • Luminus Devices
    Packaging Development Engineer, Material Science
    Luminus Devices Feb 2006 - Feb 2010
    Sunnyvale, Ca, Us
  • Spectrum Control
    Process / Assembly Engineering Manager
    Spectrum Control Mar 2000 - Feb 2006
    Fairview, Pa, Us
  • Skyworks Solutions, Inc.
    Quality Assurance 6S Engineer
    Skyworks Solutions, Inc. Feb 1985 - Mar 2000
    Irvine, California, Us

Daniel Mendoza Skills

Design Of Experiments Semiconductors Six Sigma Manufacturing Product Development Engineering Management Fmea R&d Lean Manufacturing Spc Failure Analysis Packaging Engineering Yield Product Engineering Process Engineering Semiconductor Industry Materials Process Simulation Root Cause Analysis Leadership Development Performance Tuning Process Optimization Thin Films Wire Bonding Statistical Process Control Materials Science Project Management Research And Development Packaging Development Die Attach Electronics Packaging Jmp Failure Mode And Effects Analysis Led Lighting Technology Development Yield Management And Enhancement Aerospace

Daniel Mendoza Education Details

  • Sg College
    Sg College
    Mechanical Engineering
  • Worcester Polytechnic Institute
    Worcester Polytechnic Institute
    Six Sigma

Frequently Asked Questions about Daniel Mendoza

What company does Daniel Mendoza work for?

Daniel Mendoza works for Draper

What is Daniel Mendoza's role at the current company?

Daniel Mendoza's current role is Distinguished Member of Technical Staff.

What is Daniel Mendoza's email address?

Daniel Mendoza's email address is me****@****ook.com

What schools did Daniel Mendoza attend?

Daniel Mendoza attended Sg College, Worcester Polytechnic Institute.

What are some of Daniel Mendoza's interests?

Daniel Mendoza has interest in Off Road Biking, Road, Snowboarding, Baseball, New Emerging Technologies.

What skills is Daniel Mendoza known for?

Daniel Mendoza has skills like Design Of Experiments, Semiconductors, Six Sigma, Manufacturing, Product Development, Engineering Management, Fmea, R&d, Lean Manufacturing, Spc, Failure Analysis, Packaging.

Who are Daniel Mendoza's colleagues?

Daniel Mendoza's colleagues are Milton Adams, Sagar Bhatt, Coleb Lutaaya, Lee Stanley, Maddy Royse, Ashley L. Gard, Matthew Young.

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