Daniel Mendoza Email & Phone Number

Semiconductors Packaging Dev. /Process Development and OptimizationUS Patents USD576968, USD606021 and USD603352. Used in the first LED based projection TV, Data projectors and Entertainment illumination.Multiple product development and designs have been held as trade secrets or classified to prevent public disclosureProduct design and development, project management certification, R&D, process re-engineering and optimization to meet yields, cost targets or performance in industries requiring state of the art packaging (RF, LED lighting/Projection, High Power, Wireless Signal, Medical, Consumer Applications)Other technologies include Microwave assemblies, High performance infrared FPAs and Medical electronicsLean manufacturing implementation and leadership experience with Value stream Mapping training through WPI to reduce wastes (overproduction, excess inventories, material movement, excessive motion, waiting, defects, excessive processing steps, and the under-utilization of your resources. Developed extensive expertise in heavy (5 to 20 mils) and small (1 to 3 mils) Aluminum/Gold wire bonding yield improvement to improve performance and device reliability/mechanical lifespan.Developed expertise in gold wire ball bonding/Wedge bonding by fully optimizing the process looking at each variable and their interactions.Introduced "Vacuum Die Attach Technology" to reduce solder die attach voiding from 15% to <1% while improving VSD performance.Active black belt leader in the optimization and manufacturing cost reduction of IGBT modules and IGBT gate driver modules.Extensive expertise in modern materials science (alloys, silicone and adhesives) to improve mechanical, thermal performance.Specialties: Applied statistics, loss function and orthogonal experiments in manufacturing processes/development to reduce variation of a product / process while improving throughput and reduce cost to achieve efficiency (LEAN). Processes include (not limited to) Die Attach, Adhesive Selections, Wire Bonding, Hermetic Seal, SMT, Thermal Performance Designs.

Listed skills include Design Of Experiments, Semiconductors, Six Sigma, Manufacturing, and 33 others.