Daniel Mendoza Email and Phone Number
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Semiconductors Packaging Dev. /Process Development and OptimizationUS Patents USD576968, USD606021 and USD603352. Used in the first LED based projection TV, Data projectors and Entertainment illumination.Multiple product development and designs have been held as trade secrets or classified to prevent public disclosureProduct design and development, project management certification, R&D, process re-engineering and optimization to meet yields, cost targets or performance in industries requiring state of the art packaging (RF, LED lighting/Projection, High Power, Wireless Signal, Medical, Consumer Applications)Other technologies include Microwave assemblies, High performance infrared FPAs and Medical electronicsLean manufacturing implementation and leadership experience with Value stream Mapping training through WPI to reduce wastes (overproduction, excess inventories, material movement, excessive motion, waiting, defects, excessive processing steps, and the under-utilization of your resources. Developed extensive expertise in heavy (5 to 20 mils) and small (1 to 3 mils) Aluminum/Gold wire bonding yield improvement to improve performance and device reliability/mechanical lifespan.Developed expertise in gold wire ball bonding/Wedge bonding by fully optimizing the process looking at each variable and their interactions.Introduced "Vacuum Die Attach Technology" to reduce solder die attach voiding from 15% to <1% while improving VSD performance.Active black belt leader in the optimization and manufacturing cost reduction of IGBT modules and IGBT gate driver modules.Extensive expertise in modern materials science (alloys, silicone and adhesives) to improve mechanical, thermal performance.Specialties: Applied statistics, loss function and orthogonal experiments in manufacturing processes/development to reduce variation of a product / process while improving throughput and reduce cost to achieve efficiency (LEAN). Processes include (not limited to) Die Attach, Adhesive Selections, Wire Bonding, Hermetic Seal, SMT, Thermal Performance Designs.
Draper
View- Website:
- draper.com
- Employees:
- 2675
-
DraperCambridge, Ma, Us -
Distinguished Member Of Technical StaffDraper Mar 2024 - PresentCambridge, Ma, UsAs a nonprofit research and development company, Draper focuses on the design, development, and deployment of advanced technological solutions for the world’s most challenging and important problems.Previously, the Front-End, Back-End semiconductor packaging and SMT Engineers operated separately due to technology differences and skills. As an Advanced Packaging Engineer, it is my responsibility to overlap these techniques and meet the exploding demand for ultra-compact, sophisticated SMT capable, Advance Packaging Solution assemblies. -
Technical Operations Engineering ManagerBae Systems, Inc. Mar 2014 - Mar 2024Falls Church, Virginia, Us -
Packaging And Process Development EngineerInfineon Technologies Mar 2010 - Mar 2014Neubiberg, München, De -
Packaging Development Engineer, Material ScienceLuminus Devices Feb 2006 - Feb 2010Sunnyvale, Ca, Us -
Process / Assembly Engineering ManagerSpectrum Control Mar 2000 - Feb 2006Fairview, Pa, Us -
Quality Assurance 6S EngineerSkyworks Solutions, Inc. Feb 1985 - Mar 2000Irvine, California, Us
Daniel Mendoza Skills
Daniel Mendoza Education Details
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Sg CollegeMechanical Engineering -
Worcester Polytechnic InstituteSix Sigma
Frequently Asked Questions about Daniel Mendoza
What company does Daniel Mendoza work for?
Daniel Mendoza works for Draper
What is Daniel Mendoza's role at the current company?
Daniel Mendoza's current role is Distinguished Member of Technical Staff.
What is Daniel Mendoza's email address?
Daniel Mendoza's email address is me****@****ook.com
What schools did Daniel Mendoza attend?
Daniel Mendoza attended Sg College, Worcester Polytechnic Institute.
What are some of Daniel Mendoza's interests?
Daniel Mendoza has interest in Off Road Biking, Road, Snowboarding, Baseball, New Emerging Technologies.
What skills is Daniel Mendoza known for?
Daniel Mendoza has skills like Design Of Experiments, Semiconductors, Six Sigma, Manufacturing, Product Development, Engineering Management, Fmea, R&d, Lean Manufacturing, Spc, Failure Analysis, Packaging.
Who are Daniel Mendoza's colleagues?
Daniel Mendoza's colleagues are Milton Adams, Sagar Bhatt, Coleb Lutaaya, Lee Stanley, Maddy Royse, Ashley L. Gard, Matthew Young.
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