Offering cordial and informative interaction with customers to bring awareness of the winery's product offerings, events and capabilities. Responsible for displays, sample tastings and sales of wine products at various farm and craft markets, food and wine events, area festivals and charitable functions. Providing extreme attention to winery brand awareness and customer service.

Investigating fabrication and packaging processing and material options for advanced MEMS-based devices to demonstrate technological feasibility and support manufacturing capability.> Performing deposition of various metal layers using e-beam evaporation and sputter deposition technologies for purposes of electrical contact and optical signal transfer> Performing wafer bonding for purposes of encapsulation, temporary protection and device functionality > Documenting and editing Standard Operating Procedures, process run logs and process traveler files> Determined critical parameters and metrics for monitoring wafer dicing process

Member of R&D and Consumer Ink Jet organizations responsible for the development, transfer and production support of processes and equipment for the manufacture of ink jet printheads (PHs). Technical liaison between internal and external suppliers and manufacturing organizations, responsible for enabling product quality, supply assurance and issue resolution.> Developed customized process and equipment for picking mechanically sensitive MEMS devices from dicing support tape; implemented on multiple Pilot and Production Lines within U.S. and China> Developed low surface energy thin film for improved nozzle face ink repellency and PH performance; advanced from bench top concept apparatus to commercially available system having high throughput and low UMC; developed methods for patterning from required surfaces> Established batch and inline plasma treatment capabilities for U.S. Pilot PH facility; improved wire bonding quality, encapsulation, PCB cleanliness, wetting for critical device ink flow surfaces > Coordinated process development, qualification and quality assurance for diced wafer supplier; inspection, wafer mount, dicing, UV exposure, electronic map generation and shipment to manufacturing facilities; maintained specification and process documents> Performed QC/QA on sampling of production wafer supply to identify potential quality issues; coordinated deviations to standard quality to salvage material and provide supply chain assurance> Supported U.S. Pilot and China PH production facilities; provided interface to wafer supplier; coordinated resolution of quality issues; provided training to production operations teams; monitored performance of PH equipment and coordinated yield, quality, UMC improvement initiatives> Chaired meetings with wafer fabrication and PH manufacturing organizations; within EK and with external partners; members from U.S., Europe and Asia; determine agenda, facilitated meetings, documented minutes, coordinated actions

Member of select group chosen by FX management to transfer ink jet technology from Xerox organization, establish production capability and pioneer advanced printhead design for FX product programs.> Lead project to re-establish ink jet die module processing capability in U.S. prototype facility; completed within 6 months following the complete disposition of previous equipment due to Xerox organization shut down.> Coordinated selection and transfer of approximately 70 pieces of equipment from former Xerox manufacturing sites in U.S. and Ireland to FX facilities in U.S. and Japan.> Coordinated and/or performed facilities readiness, cleanroom installation and qualification for 15 pieces of processing equipment in U.S. and 5 pieces in Japan.> Provided training and documentation to FX engineers for equipment operation and capability> Implemented options for process improvements, equipment upgrades, fixture modifications for improved yield and performance; estimated $1.3 million/year UMC savings.> provided frequent presentations to FX engineers and senior management on status, issues and opportunities.

Managed Ink Jet Business Unit Printhead (PH) nozzle coating project/team. Established and maintained production capability (U.S and Ireland), identified and solved print quality issues associated with PH, lead projects to improve performance, reduce cost and improve PH fabrication cycle time. Point of contact within corporation for low surface energy thin films. Provided thin film and plasma processing expertise for additional IJ related projects and other applications.• Responsible for all aspects of nozzle coating equipment application: specification, purchase, qualification, integration and daily operation; 20 processing systems valued at over $10 million for process development and manufacturing; 7 vendor site locations and 6 installation sites• Developed multi-step plasma process to create durable low surface energy thin film for application on IJ PHs to decrease wetting and improve PQ to enable launch of initial company printer products• Developed plasma fluoropolymer deposition process for front face coating application with improved ink repellency (surface energy lower than Teflon) to enable color printer product line launch• Developed several plasma etch (cleaning) processes for: improved coating adhesion that resulted in 12% yield increase and $1.8 million savings; to remove hydrophobic coating from inside of die module resulting in 8% UMC reduction and 33% decrease in necessary print test evaluation time; for silicon and polyimide wafers which improved wafer bonding strength by 80% and improved printhead yield by 30% • Developed UV/O3 cleaning process to remove siloxane contamination from IJ die surfaces that degraded required adhesion (averted production shutdown)• Team member that solved program threatening ink jet PQ defect; saved an estimated $3 million in spending and potential lost revenue• Developed thin film deposition process for anti-stiction application to be used in $200k collaboration with major MEMS manufacturer