Darren Lanz Email & Phone Number

Bingen, Washington, United States

Development of Semi-Automated test stands for printed circuit board assemblies and module level builds

Bingen, Wa

Test system development for UAV components and modules using Labview hardware and software with AutoHotKey scripting. Test targets include avionics, ground control stations, and smaller subassemblies. Use of serial busses (RS-232, SPI, I2C), DIO, Counters, Timers, Analog In/Out to generate signalling or interpret. Manufacturing test related support. Lean Six Sigma manufacturing improvements/projects.

Schematic capture and layout using Altium Designer.

Projects Contracting - Low power microcontroller hardware design and C++ programming. Implemented very low power E-Meter design using TI MSP430 microcontroller utilizing SPI, ADC input signal conditioning and conversion, DAC output, Timers & PWM, Interrupts for speed and low power and Digital I/Os. Co-engineered system component selection, debug, and bring-up of three single-person electric vehicle prototypes.

Embedded Computer PCBA manufacturing engineering and technical contract manufacturing supplier liaison. Performed defect analysis/root cause/resolution, design for manufacturing reviews, and provided IPC-based technical support for production.

Acting computer hardware support engineer for integration into Intel Test Tooling Operations (ITTO) test fixturing in support of all CPU products. Championed getting external test access points designed-in on state of the art computer boards to allow CPU testability. Experience in computer hardware design-for-test applications of target microprocessor silicon. Verification/Validation of JTAG functionality and system hardware functions of customized Product Platform Validation Test Interface Unit (PPV TIU). Heavily interfaced with computer board design teams from mobile/desktop/workstation/high-end MP servers to integrate test circuits in support of CPU testing.

Spent one year as a Technology Development Group SMT Reflow Process Engineer reflowing 1st generation Ball Attach CPU packages. This experience became even more critical later with VersaLogic in working with very dense IC form-factor packaging such as Intel's Atom SFF micro BGA. Worked extensively on understanding reflow profiling and utilizing Nitrogen reflow and vapor phase with appropriate solder paste chemistries to yield excellent solder joints and minimize voiding.

Responsibilities included yield engineering for front-of-line CPU package Assembly operations as well as Test and Finish processes. Monitored Cpks for appropriate process variables and reacted accordingly to root cause/troubleshoot. Wrote white papers using statistical experimentation to prove implementation of necessary changes was necessary. Member of several change control board (CCB) committees to approve or deny said white papers. Performed process improvements, yield monitoring functions, and developed new product processes/equipment using SPC.

Bsee, Digital Systems And Physics

Diploma, College Prep / Computer Programming

Activities and Societies: National Honor Society Key Club Varsity Track & Field