Simon Gu Email & Phone Number

Singapore

Singapore

Singapore

Senior product engineer of NAND Flash products.Overall product owner, 1) work on backend test failure analysis and debug with EFA, micro-probing, PFA.2) work with frontend fab team on quality issue, process improve, line extension lots disposition, RMA actions fan-out and implementation. 3) work with test team on test coverage improvement, new test setup.4) work with quality team on reliability related case or test. 5) Owner of CP test, BURN-IN test, ATE test, FT test.6) Functional test according datasheet.

Singapore

Expert in 3D NAND dry etch development, especially in super challenging structures etching. 3D NAND etch process development in Technology Development department. Worked on 96 layers to 176 layers 3D NAND, delivered successful process solutions for multiple super challenged or super high aspect ratio(about 60) etching, includes 1) Pillar channel holes, 2) TAV deep metal contact, 3) interdeck ALOX etch, 4) TAV deep metal contact punch etch, 5) staircase contact etch, 6) staircase contact carbon HM etch. Directly contributed to program level and die functional achieve.

Singapore

PIE owner of NxP 0.14um eFlash technology.Work on, 1) life cycle process sustaining, owner of WAT test, analysis on WAT test failure, 2) work with module process team on line issues, new process or equipment qualification, line execution handling. 3) SPC improvement and sustaining.4) new prototype product design rule check, JDV/ MEBES review, test key setup, process flow setup, device corner check, WAT data collection.

Singapore

Expert in HVM etch process sustaining.Work includes, process quality control, cost reduction, process further improvement CIP, chronic issue in defect or yield loss, SPC. Etch process owner in HVM foundry. Worked etching process loops includes:1) Poly gate etch on Lam platform,2) STI, AA etch3) Poly spacer etch, 4) AL metal etch,5) Contact, via etch.

new fab start-up