Dave Kinghorn

Dave Kinghorn Email and Phone Number

Custom Photonics Electronics, MEMS, Packaging & HTCC Mfg. @
Dave Kinghorn's Location
Santa Barbara, California, United States, United States
Dave Kinghorn's Contact Details
About Dave Kinghorn

Dave Kinghorn * dave@proprecisionprocess.com * Photonics Packaging Design & Assembly *Tunable InP Laser * Semiconductors * Optoelectronics * MEMS *Telcordia Reliability Test Planning & Equipment *Electropolishing Hastelloy for Superconductor manufacturing *Chip-to-Chip Waveguide Alignment, * InP-Si Laser IntegrationSolidworks * Simulation * ReliaSoft, * HTCC Electronics Packaging, Design, Reliability, Development:• Soliton Locked Silicon Photonic-Hybrid InP Laser with 0.6Hz Linewidth @ DARPA • InP-Silicon Hybrid heterogeneous tunable laser. Primary Inventor, US Patent 9,817,192, Method & Architecture for joining/aligning materials, electrical contacts, and waveguides @ Coriant/Elenion• "Lambda-Spot" InP Tunable Laser with integrated 12.5 Gbps modulator and precision aligned micro-optics wavelength locker in TOSA & SFP packages @Packet Photonics• 25 Watt Ge 3 Junction Solar Concentrator package and System Reliability Model (Energy Innovations)• "UltraVOA" 8 channel EVOA Integrated Silicon Photonic IC package @ Kotura, Inc. • "Diamond Wave High I/O Electrostatic Photonic MEMS Cross-Connect Package @ Calient Networks, Inc.• "UltraVia" Area-Array Flip-Chip to Laminate BGA Package @ Kulicke & Soffa Industries XLAM Div. • "MicroBGA" Chip Scale Package @ Tessera (uBGA original process development staff)• "Simplified Flow" Pre-Plated Frame Packaging Process @ National Semiconductor, Inc. Off-Shore Operations transitions:• Moved Energy Innovations Solar Concentrator Production to YuYao, China. • Moved National Semiconductor Pre-Plated LeadFrame production to Penang, Malaysia. Principal Engineer & Management at:Elenion Technologies(Coriant)Packet PhotonicsTouchdown Tech (Verigy, Advantest)Energy Innovations (IdeaLab)Kotura (Mellanox)Calient NetworksKulicke & Soffa National Semiconductor US Patents9,817,197 Optically Aligned Hybrid Semiconductor Device6,819,824 MEMS Optical Switch Package5,635,755 Solderable Integrated Circuit Leadframe5,454,929 Semiconductor Leadframes

Dave Kinghorn's Current Company Details
Pro Precision Process & Reliability LLC

Pro Precision Process & Reliability Llc

Custom Photonics Electronics, MEMS, Packaging & HTCC Mfg.
Dave Kinghorn Work Experience Details
  • Pro Precision Process & Reliability Llc
    President
    Pro Precision Process & Reliability Llc Jan 2017 - Present
    Santa Barbara, California Area
    NEW!!! Custom Designed Aluminum Nitride Multilevel High Temperature Cofire Ceramic Packaging, PCBs, and Heaters available in just 8-10 weeks.
  • Ucsb Optoelectronics Packaging Labs
    Optoelectronics Packaging & Reliability Program Consultant
    Ucsb Optoelectronics Packaging Labs Feb 2018 - Present
    University Of California At Santa Barbara
    Affiliated with the Optoelectronics Packaging Lab at the University of California at Santa Barbara, and the Nanofabrication Center, accepting academic & industrial small lot Optoelectronic, semiconductor, & MEMS R&D and Research builds of all types. Multiple lasers, multiple Photonic devices, no problem. I can precision align and fix into packaging fiberoptic assemblies, Free-space optics, Chip-to-chip direct waveguide to waveguide alignments, Evanescently coupled die bonding, Edge coupling, Precision eutectic die bonding, wirebonding, wafer lapping, dicing & cleaving, I can also design and source all package elements and interconnects including metallized substrate design & fab, micro-flex circuits, Thermoelectric coolers, Thermistors, microlenses, entire wavelength lockers, multilevel ceramic packaging and much more. Advise on laser & Photonic design & Fab, waveguide design and mode simulation for successful chip-to-chip interconnect, and conduct package design, thermal, stress, and optical simulations using Solidworks including Computational Fluid Dynamic Modelling. I also can assist you with FPGA based tunable laser & photonic controls and PCB layout on rigid, flexible, and ceramic PCBs, HTCC & LTCC. Additionally, if your product is already packaged and you want to discuss how to do a Reliability run-up on it, including industry standard qualification programs, I can assist you in commercial Reliability program requirements and equipment design, either bought and placed at your site, or fully outsourced to my site here and other partners.
  • Kyocera Sld Laser
    Laser & Package Thermal Simulation Engineer
    Kyocera Sld Laser Mar 2019 - Oct 2021
    Goleta, California, United States
    Thermal Simulation of GaN lasers and Package Assemblies to study laser drive conditions, laser, package, and product design parameters, and Environment conditions on Laser Junction Temperature & reliability.
    View
  • Elenion Technologies
    Reliability Manager
    Elenion Technologies Feb 2017 - May 2019
    San Francisco Bay Area
    Packaging, Process, Design, Test, & Reliability of Silicon Photonic Devices & Indium Phosphide-Silicon Hybrid Lasers. Intellectual Property Development.
    View
  • Coriant, Inc.
    Reliability Manager
    Coriant, Inc. Feb 2015 - Feb 2017
    Santa Barbara, California Area
    Design, Process, & Reliability of Indium Phosphide on Silicon Hybrid lasers and Silicon Photonic Devices. This Company Reorganized as Elenion Technologies
    View
  • Iii-V/Cmos Integrated Photonic Developer
    Assembly/Integration/Interconnect Methods Development Consultant
    Iii-V/Cmos Integrated Photonic Developer 2009 - 2017
    Santa Barbara, Ca
    Assembly, Integration, Interconnect, & Test Methods Consultant for Next Generation Integrated Photonics Devices
  • Packet Photonics, Inc.
    Consultant, Inp Integration, Packaging, Reliability, Operations
    Packet Photonics, Inc. Oct 2012 - Feb 2015
    Santa Barbara
    Design, Process, Test, & Reliability of Indium Phosphide Tunable Semiconductor Laser, Modulator. Design, Process, & Packaging of TOSA, and SFP+ Photonic Pluggable Components.
    View
  • Ops Ala Carte, Llc
    Reliability Programs Management Consultant
    Ops Ala Carte, Llc Feb 2012 - May 2013
  • Energy Innovations (An Idealab Company)
    Solar Concentrator System Design, Reliability, Gaas/Ge Packaging, & Operations Management
    Energy Innovations (An Idealab Company) 2008 - 2012
    San Diego, Ca
    Design of GaAs/Ge Solar Concentrator Die Packaging, Integration, & System Reliability • UL, IEC 62108 Certification Manager • Authored the System Reliability (Degradation) model and modeled system lifetime degradation using Reliasoft software. • Design & Development of 25 Watt GaAs/Ge Triple Junction Solar Concentrator Photovoltaic package using Solidworks and Ansys FEA. • Designed, Constructed, a 20 Megawatt/year assembly fab in Poway, CA
  • Touchdown Technologies, Inc.(Verigy, Advantest America)
    Sr. Mgr. Interconnect Technologies, Full Wafer Flash Memory Probe Cards
    Touchdown Technologies, Inc.(Verigy, Advantest America) 2006 - 2008
    • Design & Qualification of zero force Impedance tunable multichannel latching interconnect system for full wafer semiconductor probe cards. No pin count limit. Can easily handle 40,000+ I/O. • Staff technologist for MEMS electroplating & Electroforming, and other manufacturing processes. • Gold, Sulfite & Cyanide• Nickel, Sulfate, Chloride, Sulfamate, NiMn, NiCo, Black(columnar) Nickel• Copper, Sulfate, Pyrophosphate, Enthone low Stress• Rhodium, Platinum • Developed Gold-Tin Solder precision bonding process for probe card repair on SEC 860 Flip Chip Bonder• In charge of production wire bond. Qualified process on both Palomar 8000 and K&S 8098. • Qualified wafer-level automated epoxy dispense & cure process/material set on an Asymtek D-585.
  • Kotura, Inc.
    Optical Cmos Packaging & Test Engineer
    Kotura, Inc. 2002 - 2006
    View
  • Calient Networks
    Engineer
    Calient Networks 2000 - 2002
    View
  • Kulicke & Soffa Industries
    Principal Process Engineer, Xlam Substrates Div.
    Kulicke & Soffa Industries 1998 - 2000
    Electroplating Process Development of thin film HDI on FR4 Flip-Chip BGA Substrates
    View
  • Tessera
    Principal Engineer (Microbga Licensee)
    Tessera 1996 - 1998
  • National Semiconductor
    Sr. Engineer, Leadframe Plating
    National Semiconductor 1989 - 1993
    View

Dave Kinghorn Skills

Design Of Experiments Mems Engineering Management Spc Optoelectronics Failure Analysis Reliability Engineering Supply Chain Management Labview Program Management Operations Management Solidworks Electroplating Flip Chip Adhesives Management Consulting Photovoltaics Statistical Process Control Ceramics Co2 And Yag Lasers Wire Bonding Ltcc Semiconductor Packaging Photonics Packaging Ubm Probe Card Architecture Concentrator Solar Cell Packaging Manufacturing Execution Systems Solders Flex Circuits Silicon Ridge Waveguide Architectures Hdi Gallium Arsenide Packaging Vendor Qualification Intellectual Property Deelopment Indium Phosphide

Dave Kinghorn Education Details

Frequently Asked Questions about Dave Kinghorn

What company does Dave Kinghorn work for?

Dave Kinghorn works for Pro Precision Process & Reliability Llc

What is Dave Kinghorn's role at the current company?

Dave Kinghorn's current role is Custom Photonics Electronics, MEMS, Packaging & HTCC Mfg..

What is Dave Kinghorn's email address?

Dave Kinghorn's email address is da****@****ail.com

What is Dave Kinghorn's direct phone number?

Dave Kinghorn's direct phone number is +185823*****

What schools did Dave Kinghorn attend?

Dave Kinghorn attended San José State University, San Jose State University, University Of Missouri-Kansas City.

What skills is Dave Kinghorn known for?

Dave Kinghorn has skills like Design Of Experiments, Mems, Engineering Management, Spc, Optoelectronics, Failure Analysis, Reliability Engineering, Supply Chain Management, Labview, Program Management, Operations Management, Solidworks.

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