Mechanical Design Engineering Management
Design and Construction of 20-45 GHz Modules for Commercial Air, Space, and Military Applications Built Around In-House-Designed GaN and GaAs Die. Layout, BOM development, 3D Design, Thermal Analysis, Interface Design, Design Reviews, and 2D Drawings of All Parts and Assemblies of• Viasat 4 Satellite Antenna Array TR Modules, Including GaN & GaAs Packages and RFIC Flip Chip Designs• 50W Ka-Band Terrestrial SSPA with 8-Way Split-Block Combiner, GaN PA Die, Forced Convection, and 800W Dissipation• Inflight WIFI Aircraft-to-Satellite Transceiver. Split-Block Construction with Sintered Ag GaN Die Attach on Controlled CTE Substrate. 150W Dissipation• R&D Study on GaN Die Attach (Sintered Ag, AuSn, Controlled-CTE Substrates) for Use Across Viasat Products• Phase Shifter Laminate QFN IC Package• Viasat 3 Satellite Antenna Array TR Modules. Iterated Multiple Times in Conjunction with the Antenna Array DesignOther Activities:• Created & Conducted Mechanical Engineering Meetings Across Viasat Geographic Locations to Share Experience Corporation-wide• Mentored Engineers on Various Subjects like Manufacturing Methods, Die Attach, Bolted Joints, Surface Finishes, Sealing Design, Die Thermal Analysis, etc.• Set Up Training Plans (GDT, ANSYS, etc.) For Mechanical Engineering Staff