Team Leadero Supervised U.S. based process-engineering activities.o Completed strategic project timeline formation.o Ensured completion of key objectives. Program Manager: Chemical Vapor Deposition (CVD) filmso Achieved system orders at key production nodes.o Achieved global distribution of high thru-put mainframe (GT).o Achieved global distribution of new product (HARP).o Manage system installations from order thru final acceptance.

Endura 5500 Physical Vapor Deposition (PVD): Process qualification, integration, new market penetration, DOE, reliability improvement thru CIP's. Inspection Tool Applications: Laser inspection application programing, optimization. Tool matching. Reactive Ion Etch: Process qualification, integration, DOE, reliability improvement thru CIP's. Epitaxy Deposition: Process qualification, integration, DOE, reliability improvement thru CIP's.

o Managed all aspects of startup, support, qualification for wafer manufacturing equipment in multiple high volume factories.o Lead troubleshooting teams to solve complex equipment and facilities issues. o Global Technical Expert in multiple systems including: Applied Materials Epitaxy Reactor (7800, 7810, 7010, 7700), Chemical Vapor Deposition (2100, 2100A, 5000 TEOS, 5000 Tungsten, Producer SE, GT), Reactive Ion Etchers (8100, 8300, 5000 Etch, Centura DPS Etch), PVD Metal Deposition tool (AMAT Endura 5500).