Knowledge of Soldering Chips / IC for issue debugging.Oscilloscope readings and analysis of signals.Familiar with signal integrity.Familiar with Digital Multimeters, scopes and analyzers: measure powers,capture data, usage and board soldering, rework equipment.Ability to rack, stack, cabling equipment.Reproduce Customer issues and root cause.Knowledge on hardware, software and test tools needed for validationand debug activities.Experience on PC hardware assembly and software/driver installation.User-level understanding of Windows and Linux.End to end management of test efforts including generating test cases,review scope with teams, track execution, log defects and share regularupdates.Provide regular updates during defect triage and issue resolution.Good team member skills and able to work with extended team membersin co-ordinating system setup and test execution.Ability to navigate and understand design information like schematics,board files, hardware spec documentation, etc.OS :Proficient in Windows OS、Mac OS、Android、iOSExperience with Windows Server、Linux、VMware、VROCOffice Application :Proficient in Microsoft OfficeDesign :Cadence AllegroCAD :AutoCAD 2D、SolidWorksCommunication :TETRA、Project 25、DMRScript Language :UEFI Shell、Tera TermEquipment :Oscilloscope、LA、Spectrum Analyzers、DMM、E-LoaderRework :Electrical component swap, replacement.Board rework such as 0603, 0402, 0201 chip size.BGA chip type component and variety IC packages manualsoldering(reballing) and BGA machine operation.RF semi-rigid/pig tail soldering, test wire soldering, RF passivecomponents soldering (e.g. duplexer, diplexer, coaxial connector, RFswitch connector.)Verify rework quality by multimeters.Lab Management :Lab stuff (equipment, environment/spaces, materials, supplies,accessories, tools, receive vendors and apply lab entry) management,maintenance, fulfillment, distribution, recovery and disposition.Perform Lab inventory logistics, tracking, and management.