David Duffin

David Duffin Email and Phone Number

US General Manager and Head International Customer Sales @ Yangtze Memory Technologies
Santa Clara, CA, US
David Duffin's Location
Santa Clara, California, United States, United States
David Duffin's Contact Details
About David Duffin

Experienced Engineering leader.• Have been in the Semiconductor / Flash Memory / Storage industry continuously since 1987, mostly in Product & Test Engineering with time spent in additional roles such as Country General Management, Customer Support, Development, Manufacturing, PMO, Customer Field Support and Physical Failure Analysis.• Have worked with a wide range of customers in Military, Automotive, Mobile, Industrial, Enterprise, Channel and Retail markets.• Responsible for $5B+ in shipments per year.• Have built and managed multiple worldwide cross functional teams, of up to 350 engineers.• Am used to regularly and directly interacting with customers, partners, and all functions within the company from the top executive to individual contributor levels• I understand engineering is a relentless focus on time to market, cost reduction and quality improvement and the ability to balance these items to meet the market needs and to maximize profitability.• I strongly believe in an environment of strong processes with a culture of empowerment and responsibility and believe that identifying and growing future leaders across all levels of the organization is a key attribute.

David Duffin's Current Company Details
Yangtze Memory Technologies

Yangtze Memory Technologies

View
US General Manager and Head International Customer Sales
Santa Clara, CA, US
Website:
ymtc.com
Employees:
1151
David Duffin Work Experience Details
  • Yangtze Memory Technologies
    Us General Manager And Head International Customer Sales
    Yangtze Memory Technologies
    Santa Clara, Ca, Us
  • Yangtze Memory Technologies
    Us General Manager And Head International Customer Sales
    Yangtze Memory Technologies Mar 2019 - Present
    San Jose, California, United States
  • Yangtze Memory Technologies Co.
    Vice President Product & Test Engineering
    Yangtze Memory Technologies Co. May 2016 - Mar 2019
    San Jose
    Leading all Product, Test and Assembly Engineering for YMTC
  • Sandisk
    Vp Product & Test Engineering
    Sandisk Apr 2011 - Mar 2016
    Responsible for a multidisciplinary team comprised of Memory PE, Final Product PE, Memory TE, System TE, Memory Health, ASIC and Test Equipment Engineering that owned all wafers from Die Sort (memory and controller) through to all final products including wafers, packaged memory, USB, SD/uSD, mobile and embedded MCPs, Client and Enterprise SSDs. Team was also responsible for the verification and screen development of all new die nodes, die, revisions, excursions and process changes.Led culture change from Retail focused company to one that became a quality leader at some of the most demanding OEM customers with much improved processes and consistent delivery of schedules and world class yield and test time indices.Grew management depth and built strongly executing teams in multiple locations in the US, Israel, Japan, China, India and Malaysia.
  • Spansion
    Director, Program Management Office
    Spansion Mar 2010 - Apr 2011
    Responsible for the Infrastructure and Compliance of all Spansion products to Spansion’s Product Life Cycle Management Systems and methodologies from design Tape Out to production End Of Life
  • Spansion
    Director, Product Engineering
    Spansion Dec 1999 - Feb 2010
    Responsible for all Product and Test Engineering Worldwide for the Wireless Solutions Division.
  • Amd
    Product Engineer
    Amd 1995 - 2005
  • Amd
    Product And Device Analysis Engineer At Frimley Facility
    Amd Sep 1995 - Nov 1999
    Electrically and Physically Analyze all AMD Flash / Eprom Customer returns in Europe.
  • Hughes Microelectronics
    Test Engineer At Glenrothes Facility
    Hughes Microelectronics Jul 1990 - Sep 1995
    Test and Product Engineering developing new ASICs and supporting Production

David Duffin Skills

Product Engineering Semiconductors Testing Semiconductor Industry Test Engineering Ic Embedded Systems Failure Analysis Asic Product Lifecycle Management Engineering Management Flash Memory Cross Functional Team Leadership Wireless Soc Product Management Debugging Design Of Experiments Cmos Manufacturing Electronics Hardware Architecture Mixed Signal Yield Silicon Management Application Specific Integrated Circuits Spc Consumer Electronics Embedded Software Firmware Integrated Circuits Fmea Signal Integrity R

David Duffin Education Details

Frequently Asked Questions about David Duffin

What company does David Duffin work for?

David Duffin works for Yangtze Memory Technologies

What is David Duffin's role at the current company?

David Duffin's current role is US General Manager and Head International Customer Sales.

What is David Duffin's email address?

David Duffin's email address is da****@****isk.com

What is David Duffin's direct phone number?

David Duffin's direct phone number is (408)-962*****

What schools did David Duffin attend?

David Duffin attended Edinburgh Napier University, Abertay University, Dundee Institute Of Technology, Kirkland High School.

What skills is David Duffin known for?

David Duffin has skills like Product Engineering, Semiconductors, Testing, Semiconductor Industry, Test Engineering, Ic, Embedded Systems, Failure Analysis, Asic, Product Lifecycle Management, Engineering Management, Flash Memory.

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