Microelectronics Product Engineer
CurrentIII-V semiconductor manufacturing and Wafer Level Packaging (WLP) of GaN, GaAs, and InP HEMT technologies. 3D integration of RF/Digital MMIC's at chip level. Qualification of chip packaging and chip to board integration for flight hardware. Technical contributor on DARPA's SMART, WBSIII, THz, and MPD microelectronics programs.