TRUMPF Photonics Inc. 11/2013 - Present2601 U.S. Route 130 SouthCranbury, NJ 08512Engineering Manager:• Reduce Scrap Rate by $200K/Month through specification validation• Reduced Cycle Time by 30% by developing new processes which created parallel paths through bottle neck equipment• Implemented new processes and process equipment into production• Implemented Quality Operating Standards to increase equipment availability and/or increase yield• Identified and filled organizational gaps within the organization• Developed the engineering team through rigorous training, documentation and application of skills• Developed qualification process to reduce BOM losses

• Increased Customer Quality audit score from “Needs Improvement” to a perfect score in 5 quarters. • Solved a customers’ major yield excursion by identifying root cause at our supplier. Implemented permanent corrective actions that resulted in a 1% improvement in our customers’ yield. • Manage a team of sustaining engineers responsible for yield and process improvement.• HBT technology transfer between international facilities resulting in a 200 wafers/week capacity increase while making the supply chain more robust. Wrote and published results in GaAs MANTECH proceedings (April 2008).• Upgraded device fabrication capability from 100mm to 150 mm while streamlining the process to reduce cycle time by 20%. As a result, IQE became the first 150mm Epitaxy supplier to provide fully mapped wafer device data.• Develop and improved measurement and data systems in order to align manufacturing systems across multiple facilities.

Wafer Fab Director:•Directed a Team of Managers, Engineers, Supervisors, Technicians & Operators totaling >150 employees that generated >$0.5M/Day in revenue.•Responsible for Budgeting, and Strategic Planning to enable and realize the corporate business objectives.•Increased Fab capacity 4X over 6 sequential growth quarters, corresponding to a revenue increase from $21M to $50M/Qtr.•14 years of continuous service with a record of professional advancement during multiple reorganizations, reductions in work force and expansions.Engineering Manager & Yield Enhancement Manager:•Implemented SQC methodology of Testing at Probe which resulted in a 3% increase in Die Yield across all product lines. The SQC results initiated sample testing, which resulted in a 5X reduction in test time at a higher quality level.•Implemented SPC Fab wide by integrating the critical node analysis technique and the M/PCpS system which includes Gauge R&R, capability studies, DOE’s to determine critical effects and control plans to lock down critical variables. This resulted in stable and predictable processes running in production.•Led multiple problem solving teams using the 8 disciplines of problem solving. Root cause was confirmed with permanent corrective action and corrective systems to prevent similar recurrence. Received corporate recognition award.•Led the engineering initiative to transfer Fab1 to Fab2 resulting in the first 6” Analog GaAs Fab in full production.•Implemented an audit based Safety Team using QOS Methodology which reduced safety related issues by >50%.Thin Films Manager•Implemented a QOS methodology in the Thin Films Area that continues to be used as a corporate standard for reporting yield in addition to driving yield improvements to meet corporate goals.•Developed and implemented into production a Silicon Nitride encapsulation process for RTA of MESFET products resulting in increased safety and lower manufacturing cost.