Hard Skills Technical know-how 18+ years of experience in semiconductor Discrete, Analog, Mixed-signal and RF test development and high volume operation and management Experienced at providing best in class test solution for both of wafer probing and final testing (Strip-test, Turret, PnP & Gravity handlers) Profound knowledge in semiconductor assembly, equipment and material. Versed in semiconductor product physical and electrical analysis, reliability and quality standards Plenty of assembly knowledge in Back Metal Sputtering, Die Bond, Wire Bond, Clip Bond, Dicing, Molding, Trim/Form and packing Expert in DMAIC methodology and lean, problem solving skills and 8D, FMEA, SPC, DOE, 3x5 Why etc. Top notch statistical analysis skills with Minitab, JMP and Microsoft Excel Knowledge of C, C# and LabVIEW programming skills Expert in ITEC uParset software and hardware and familiar with AWACS, ENOVIA , BCaM and Workday Skillful with plotting and graphical display , communicate effectively with charts and graphs and effective presenterSoft Skills Business know-how 14+ years of various management roles and experienced at developing high-performance team with proven ability to focus and work proactively, coaching and stretching employee problem solving muscles, inspiring and mentoring others to be creative and excel Proven track records of project coordination, cost and timelines, results driven, team facilitator and change agent Data driven and financial oriented. Natural leader and influencer Excellent English verbal and written communication skills; team collaborator, effective communication skills, openness and able to speak to people at different levels in an organization and comfortable with others from different cultures and regions
Listed skills include Semiconductors, Ic, Electronics, Semiconductor Industry, and 12 others.