Principal Packaging Engineer
Current
Apr 2019 - Present
AeroLeads people directory · profile
David Youm Email & Phone Number
Principal Packaging Engineer
at
Allegro MicroSystems
1 work email found
@allegromicro.com
LinkedIn matched
✓ Verified May 2026
4 data sources
Profile completeness 100%
Current company
Role
Principal Packaging Engineer
Location
Greater Boston, United States, United States
Who is David Youm? Overview
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Quick answer
David Youm is listed as Principal Packaging Engineer at Allegro MicroSystems, based in Greater Boston, United States, United States. AeroLeads shows a work email signal at allegromicro.com and a matched LinkedIn profile for David Youm.
David Youm previously worked as Senior Microelectronics Packaging Engineer at Allegro Microsystems and Staff Packaging Engineer at Knowles Corporation. David Youm holds Lean Six Sigma Green Belt from Thayer School Of Engineering At Dartmouth.
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{first_initial}{last}@allegromicro.com
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Profile bio
About David Youm
Semiconductor IC package engineering expert through extensive technical and operational back ground in world wide wafer Fab manufacturers, assembly and packaging houses with hands-on experience in defining packaging technology road map, packaging process and materials justification, new product intro engineering for Advanced packages, BGA substrate based Assembly factories setup, factory qualification & mass-volume ramp-up, factory equipment selection, installation, BOM selection through engineering DOE and process designing for new packages, BGA/QFN/MIS, WLP/Bumped CSP/ Embedded SIP/Flip Chip/ TSV/ Fan-out Wafer Level Embedded die into PCB substrate foundry management, Less Cost & Performance driven package development, Mobile connectivity, Analogue & Mixed signal New products.- MEMS module and IC package /process engineer with extensive technical experience in worldwide wafer Fab manufacturers, assembly houses.- Hands on experience MEMS module and IC chip process integration and process engineering.- Deep knowledge on IC packaging technology road map, MEMS module and IC assembly process and materials justification, packaging feasibility, OSAT NPI and HVM. - Expert on MEMS module package design and PCB modeling and simulation.
Listed skills include Ic, Mems, R&D, Packaging, and 11 others.
Current workplace
David Youm's current company
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8 roles · 41 years
David Youm work experience
A career timeline built from the work history available for this profile.
Senior Microelectronics Packaging Engineer
- Cu pillar bump WLCSPand Flip Chip Packaging development for MOSFET Power device
- Pb-free solder bumping WLCSP packaging development for Automotive sensor products
- 3D modeling Solidworks and Autodesk Inventor, thermal/mechanical FEM, Ansys Simulations.
- OSAT HVM Automotive & Commercial devices package development.
Apr 2019 - Jun 2024
Principal Packaging Engineer
Apr 2019 - Jun 2024
Staff Packaging Engineer
- Developed MEMS Microphone packages with embedded Resisters, Capacitors and ICs.
- Designed PCB for Flip-chip DSP MEMS microphone package.
- Defined MEMS Microphone process integration: SMT inductors, back-grinding and saw, die-bond, wire-bond, encapsulation, underfill, Electroless and Electrolytic plating, lid soldering.
- Developed wafer level RDL and bump process for MEMS microphone packages.
2017 - 2019
~2 yrs
Principal Packaging Engineer
- Qualified SIP package for RF device module for NPI and HVM.
- Drove package development, QFN/MIS, LGA, BGA, LTCC, SIP, 3D Stack, Flip Chip, MIS, TSV.
- Defined feasibility for FOWLP, Micro-bumped TSV Si interposer 3D stacking for RF IC packages.
- Lead Copper wire bond qualification, AEC-Q006 requirement.
- Drove hi-voltage/hi-power package development, Module modeling simulation.
- Created and updated assembly and packaging design rules.
2011 - 2017
~6 yrs
Senior Mts (Packaging Engineering)
- Created and updated design rule for assembly.
- Justified wafer Fab process and metallization for wire bond reliability.
- Qualified Mold compound for Ag/Cu migration issue for Sumitomo (Red-Phosphorus).
- Drove automotive products qualification.
- Resolved assembly issues: die cracking, package delamination, wire bond cratering, wire sweeping, moisture sensitivity failures.
1996 - 2011
~15 yrs
R&D Packaging Senior Manager
Completed HVM qualification BGA factory: Process optimization, BOM selection, Equipment setups, reliability tests, Customer visiting and presentations for mass production volume marketing.
1995 - 1996
~1 yr
Engineering Manager
Package process optimization, Material selection and evaluation, FAI, Create and update Design rule. Process Engineering team Manager / Lead engineering, IC assembly process engineer for wafer back grinding, sawing, wire bond, die bond and cure, plasma clean, mold and PMC, soldering, RDL and solder-ball/Cu pillar bumping. plating for lead frame and PCB.
1985 - 1995
~10 yrs
2 education records
David Youm education
Lean Six Sigma Green Belt
Thayer School Of Engineering At Dartmouth
Microelectronics
Portland Community College
FAQ
Frequently asked questions about David Youm
Quick answers generated from the profile data available on this page.
What company does David Youm work for?
David Youm works for Allegro MicroSystems.
What is David Youm's role at Allegro MicroSystems?
David Youm is listed as Principal Packaging Engineer at Allegro MicroSystems.
What is David Youm's email address?
AeroLeads has found 1 work email signal at @allegromicro.com for David Youm at Allegro MicroSystems.
Where is David Youm based?
David Youm is based in Greater Boston, United States, United States while working with Allegro MicroSystems.
What companies has David Youm worked for?
David Youm has worked for Allegro Microsystems, Knowles Corporation, Skyworks Solutions, Inc., Maxim Integrated, and Stats Chippac Ltd..
How can I contact David Youm?
You can use AeroLeads to view verified contact signals for David Youm at Allegro MicroSystems, including work email, phone, and LinkedIn data when available.
What schools did David Youm attend?
David Youm holds Lean Six Sigma Green Belt from Thayer School Of Engineering At Dartmouth.
What skills is David Youm known for?
David Youm is listed with skills including Ic, Mems, R&D, Packaging, Semiconductors, Semiconductor Industry, Mixed Signal, and Design Of Experiments.
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