David Youm Email and Phone Number
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Semiconductor IC package engineering expert through extensive technical and operational back ground in world wide wafer Fab manufacturers, assembly and packaging houses with hands-on experience in defining packaging technology road map, packaging process and materials justification, new product intro engineering for Advanced packages, BGA substrate based Assembly factories setup, factory qualification & mass-volume ramp-up, factory equipment selection, installation, BOM selection through engineering DOE and process designing for new packages, BGA/QFN/MIS, WLP/Bumped CSP/ Embedded SIP/Flip Chip/ TSV/ Fan-out Wafer Level Embedded die into PCB substrate foundry management, Less Cost & Performance driven package development, Mobile connectivity, Analogue & Mixed signal New products.- MEMS module and IC package /process engineer with extensive technical experience in worldwide wafer Fab manufacturers, assembly houses.- Hands on experience MEMS module and IC chip process integration and process engineering.- Deep knowledge on IC packaging technology road map, MEMS module and IC assembly process and materials justification, packaging feasibility, OSAT NPI and HVM. - Expert on MEMS module package design and PCB modeling and simulation.
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Principal Packaging EngineerAllegro Microsystems Apr 2019 - PresentManchester, Nh, Us
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Senior Microelectronics Packaging EngineerAllegro Microsystems Apr 2019 - Jun 2024Manchester, Nh, Us• Cu pillar bump WLCSPand Flip Chip Packaging development for MOSFET Power device• Pb-free solder bumping WLCSP packaging development for Automotive sensor products • 3D modeling Solidworks and Autodesk Inventor, thermal/mechanical FEM, Ansys Simulations.• OSAT HVM Automotive & Commercial devices package development.
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Principal Packaging EngineerAllegro Microsystems Apr 2019 - Jun 2024Manchester, Nh, Us
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Staff Packaging EngineerKnowles Corporation 2017 - 2019Itasca, Illinois, Us• Developed MEMS Microphone packages with embedded Resisters, Capacitors and ICs.• Designed PCB for Flip-chip DSP MEMS microphone package. • Defined MEMS Microphone process integration: SMT inductors, back-grinding and saw, die-bond, wire-bond, encapsulation, underfill, Electroless and Electrolytic plating, lid soldering.• Developed wafer level RDL and bump process for MEMS microphone packages. -
Principal Packaging EngineerSkyworks Solutions, Inc. 2011 - 2017Irvine, California, Us• Qualified SIP package for RF device module for NPI and HVM.• Drove package development, QFN/MIS, LGA, BGA, LTCC, SIP, 3D Stack, Flip Chip, MIS, TSV.• Defined feasibility for FOWLP, Micro-bumped TSV Si interposer 3D stacking for RF IC packages.• Lead Copper wire bond qualification, AEC-Q006 requirement.• Drove hi-voltage/hi-power package development, Module modeling simulation. • Created and updated assembly and packaging design rules. -
Senior Mts (Packaging Engineering)Maxim Integrated 1996 - 2011San Jose, Ca, Us• Created and updated design rule for assembly. • Justified wafer Fab process and metallization for wire bond reliability. • Qualified Mold compound for Ag/Cu migration issue for Sumitomo (Red-Phosphorus).• Drove automotive products qualification. • Resolved assembly issues: die cracking, package delamination, wire bond cratering, wire sweeping, moisture sensitivity failures. -
R&D Packaging Senior ManagerStats Chippac Ltd. 1995 - 1996Singapore, SgCompleted HVM qualification BGA factory: Process optimization, BOM selection, Equipment setups, reliability tests, Customer visiting and presentations for mass production volume marketing. -
Engineering ManagerAmkor Technology, Inc. 1985 - 1995Tempe, Arizona, UsPackage process optimization, Material selection and evaluation, FAI, Create and update Design rule. Process Engineering team Manager / Lead engineering, IC assembly process engineer for wafer back grinding, sawing, wire bond, die bond and cure, plasma clean, mold and PMC, soldering, RDL and solder-ball/Cu pillar bumping. plating for lead frame and PCB substrate, Lead frame and PCB design.
David Youm Skills
David Youm Education Details
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Thayer School Of Engineering At DartmouthLean Six Sigma Green Belt -
Portland Community CollegeMicroelectronics
Frequently Asked Questions about David Youm
What company does David Youm work for?
David Youm works for Allegro Microsystems
What is David Youm's role at the current company?
David Youm's current role is Principal Packaging Engineer at Allegro MicroSystems.
What is David Youm's email address?
David Youm's email address is da****@****inc.com
What schools did David Youm attend?
David Youm attended Thayer School Of Engineering At Dartmouth, Portland Community College.
What skills is David Youm known for?
David Youm has skills like Ic, Mems, R&d, Packaging, Semiconductors, Semiconductor Industry, Mixed Signal, Design Of Experiments, Silicon, Analog, Cmos, Soc.
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