Materials and Structural Analysis Division, Semiconductor Business Unit, Analytical Instruments Group. Dual beam electron microscope research and development, automation, metrology, SEM, FIB, and STEM analysis.

• Operated multiple dual beam electron microscopes and other lab equipment to extract and image lamellae from semiconductor microchip wafers in development by the Etch and Deposition Product Groups• Worked independently from schematics, diagrams, and written and verbal instructionsPre-processed coupons/chips including cleaving wafers, Iridium, Titanium, and Hafnium Oxide ALD, and ex-situ AccuFlo and Loctite/epoxy application• Advanced specialized processing techniques such as Horizontal HAR STEM for 20um+ ONON stacks, and Carbon on Metal for stabilized lamella thinning• Microscopy techniques employed included STEM, SEM, HAR STEM, Horizontal HAR STEM, Planar STEM, Inverted STEM, CoM, and FIB-SEM. Introductory level experience with AFM and EDX• Performed tool troubleshooting functions, operational tests, fault isolation on systems and equipment, and assisted in determining methods and actions to remedy malfunctions• Maintained a positive and productive work environment through clear communication with technicians, engineers, and customers• Trained team members in microscopy, sample processing, and day-to-day lab operations

• Tutored college students in algebra, trigonometry, calculus, and physics.

• Developed interlinked fillable forms for employee usage• Processed sensitive payroll data• Projected necessary staffing based on annual records• Determined inefficiency sectors and created solutions

• Analyzed E coli mobility with fluorescence optical microscopy in thin film environments.• Designed and manufactured 3D printed membrane vessels for prolonged bacteria movement imaging.