Leadership role to review, analyze, assess and improve supplier manufacturing processes and procedures with focus on improved customer experience by driving Quality and Reliability deliverables throughout the product lifecycle that reduce Time to Market, optimize cost, meet yield goals.• Served as HP Manufacturing Technical lead in supplier management overseeing supplier selection, audits, AOS, Quality and Reliability definition and management, environmental compliance, cost, field performance, Failure Analysis Corrective Action (8D) and customer escalations. • Drove improvements in supplier production efficiencies by continuous improvement and breakthrough methods. Areas impacted include DFx, device and product qualification methods, risk management strategies, material selection, SMT and Wave Solder processes, Assembly and rework processes, production ESS: burn-in, T/C, Vibration and combination stresses (HASS, HASA, ORT…) resulting in >$1.5M annual savings. • Optimized New Product Introduction (NPI) methods that reduced release timing from an average of 3 months to <2 months, a >35% reduction in Time to Market (TTM).• Devised and drove disciplined ‘Process Readiness Reviews’ for both surface mount (SMT) and wave solder processing that resulted in a reduction of initial defects by >50%.Managed OEM/ODM, internal factory and field metrics to ensure customer satisfaction. Lead role driving failure analysis efforts in both factory and field. Technical Committees:Member of the Packaging and Assembly Technical Committee for the IEEE International Reliability Physics Symposium (IRPS),IPC 9-82 Power Conversion Devices Standards Subcommittee: IPC-9592AIPC 3-11g Corrosion of Metal Finishes Task Group

Leadership role defining, qualifying and managing the release and production of world class custom ASIC devices employed in Enterprise Servers. Ownership spanned from Si fab, package development, assembly and test. Quality, reliability, cost, assurance of supply, and technical evaluations. • Provided technical leadership during definition and implementation phases. Lead validation of quality, reliability, yield and value chain requirement and cost avoidance opportunities. Includes all facets of the final product and value chain. • Lead package development activities that lead to industry leading 52.5mm x 52.5mm, 1.0mm pitch LGA enablement. • Drove risk mitigation strategy that resulted in >$2M in cost avoidance and 6 month improvement in time-to-market employing data driven decision making.

Managed a team of engineers chartered with releasing new products and fabrication processes into high volume production within a world wide network of fabrication, assembly, test and burn-in facilities. Required in-depth knowledge of semiconductor product development, value chain, Quality and Reliability principles and application with focus on Time-to-Market, creativity, innovation and cost.