David Bon Email & Phone Number

Plano, Tx, Us

Plano, Tx, Us

Richardson, Tx, Us

Design and develop software(C/C++) for the Very Low Cost Tester(VLCT) test equipment used in the manufacture of semiconductor devices. Support over 2000 testers world wide. Highlights include:• Realized an average of 25% test time reduction across existing test programs with the development of an optimization tool for the VLCT tester• Improved programming of power supplies to support 5-10% test time reduction• Reduced tester downtime by 20% with the development of production diagnostics• Developed a Quality Assurance tool to check the accuracy of device sorting in test programs. Tool identified approximately 10% of existing test programs with defects.• Extended and maintained compiler to add new functionality to tester to support new products• Implemented software to control a power module used to test high power devices. Communication to module used I2C protocol• Developed and maintain communication software between main application and tool application using named pipes and shared memory.• Provided application support to test engineers to assist them in developing their test programs• Developed new features on tester using existing hardware to extend the life of the hardware• Developed an engineering tool to support the diagnostics of mixed signal testing• Developed interactive engineering diagnostic tool for new power supply hardware.• Provided training to users world wide on the use of engineering tools for VLCT test equipment

Dallas, Tx, Us

Leader of multiple projects to support organizational goals of increasing new product revenue, reducing costs and improving manufacturing capacity. Highlights include:* Qualified new subcontractor for wafer chip scale packages providing an annual cost savings of $1,200,000* Led team on multiple package start-ups that resulted in annual cost savings of $400,000* Led Capital Projects to install test equipment at subcontractors resulting in 20% reduction in manufactured device cost* Led team at external supplier in process improvements resulting in defect reduction of 80%* Negotiated and qualified bare die process at new subcon resulting in 66% cost reduction* Traveled to subcontractors to resolve quality problems, conduct business reviews, perform quality audits, and perform technical assessments

Dallas, Tx, Us

Leader of multiple projects to develop new packages that were smaller, thinner and cheaper while providing the same quality and reliability. Highlights include:* Qualified subcontractor in China for SOT packages providing annual cost savings of $2.4M* Led over 17 projects to convert our subcontractors from SnPb to producing lead free and green packages. Published a paper in EDN on this subject.* Developed 0.4mm thick QFN package to win 10 million unit new business with major customer* Qualified second source for Chip On Lead process resulting in 20% cost reduction and supporting $20,000,000 business with major customer* Completed qualification and ramp to production for 3 pin SOT package resulting in annual cost savings of $500,000* Coordinated resolution to package crack problem on DRL package resulting in most robust and reliable leadframe design.* Solved low ball shear problem at China subcontractor and drove process improvement changes resulting in 50% increase in ball bond reliability

Dallas, Tx, Us

Designed and developed real time embedded machine control software for wire bonding equipment.* Led Productivity Improvement Team which made an average sprint throughput improvement of 20% per year. Improvements enabled approximately $1.4M capital avoidance per year* Developed automatic update of stitch bond location resulting in a 16.5% equipment utilization improvement* Developed database report generator leading to an MTBA improvement of about 300%* Implemented recovery software to avoid operator errors leading to a reduction in bond related defects of 1500 PPM.* Developed processes and software to enable assembly sites to eliminate leadframe mapping which resulted in 20% SPPH increase* Developed board level diagnostic package for embedded 80186 communication board.* Designed, developed and tested software for an inline curing system thus eliminating the need for a separate oven to cure the die attach epoxy. * Developed software for multi column clamp resulting in a 3.5% SPPH improvement on small pin count packages* Solved quality problem of stray wire and implemented software to ensure problem could not happen again* Developed an adaptable software positioning algorithm to compensate for temperature variations of the transport rails* Team leader of 8 software engineers* Garnered customer funding by developing and publishing software roadmap* Worked on all areas of the software life cycle from requirements definition through software testing and verification* Published regular training newsletters to assembly sites leading to a 25% increase in operator efficiency* Focal point for customer interface: Analyzed customer requirements and decided what features would be implemented for next software release* Made multiple trips to assembly sites in Mexico, Malaysia, and Singapore to provide training on software and machine operation

Msme, Packaging Engineering

Bsee, Electrical Engineering