David Lindley Email & Phone Number

Senoia, Ga, Us

Palo Alto, California, Us

Neubiberg, München, De

I was responsible for orchestrating multiple integrated circuit Intellectual Property (IP) projects and managing cross-functional teams across various global locations. My key responsibilities and achievements included: 1. Management of Integrated Circuit IP Projects: As the Program Manager, I orchestrated multiple concurrent integrated circuit IP projects and scheduled new IP initiatives. This involved overseeing the entire project lifecycle, ensuring timely delivery and alignment with technical specifications. 2. Scrum Master for U.S.-Based Team: Performed duties as a Scrum Master, expertly facilitating daily standup meetings and sprint planning sessions. Ensured effective collaboration and steady project progression, maintaining agile principles and methodologies. 3. Leadership of Cross-Functional Teams: Led cross-functional teams located in Kentucky, Colorado, California, Germany, Israel, and India. Coordinated efforts across different time zones and cultural backgrounds, promoting seamless teamwork and communication. 4. Hiring Coordinator Role: Undertook the role of hiring coordinator for the group. Managed the recruitment process end-to-end, including reviewing resumes, conducting initial phone screenings, arranging technical screenings, consolidating evaluations, and collaborating with HR to finalize job offers.Overall, my role required a blend of technical project management, agile leadership, and global team coordination. My contributions were instrumental in driving the success of the System Resource Subsystem group, delivering high-quality IP projects, and building a strong, capable team.

San Diego, Ca, Us

In my role as Program Manager and Scrum Master for electronic assembly research and development, I led the development of innovative products and efficiently managed product engineering processes. My key responsibilities and achievements included: 1. Leadership in Electronic Assembly R&D: Spearheaded innovative product development, including a 1.3m rigid satellite communications terminal, inflatable ray dome inflation units, and mud box modems. This involved overseeing the entire product development lifecycle. 2. Product Engineer for GATR Modems: Acted as the Product Engineer for GATR modems. Created and implemented over 120 Engineering Change Orders (ECOs) to four drawing packages, ensuring the modems were production-ready and met high-quality standards. 3. Management of ECOs and PLM Cycle: Efficiently managed ECOs through the Product Lifecycle Management (PLM) cycle into production. Ensured a seamless transition and effective implementation of changes and improvements. 4. Comprehensive Task Management: Managed critical tasks including delivering status presentations to management, developing and monitoring a budget of approximately $3M/year, formulating iteration plans, leading sprint planning sessions, overseeing daily standup meetings, reporting weekly status, and conducting quarterly in-depth management presentations. 5. Leadership During COVID-19 Outbreak: Led a production team during the COVID-19 outbreak to successfully deliver a $1M order of GATR 1050 modems. Demonstrated resilience and adaptability in navigating the challenges posed by the pandemic.Overall, my role required a blend of technical expertise, project management skills, and agile leadership. My contributions were key in advancing the research and development of electronic assemblies, ensuring high-quality product output, and maintaining operational efficiency in challenging times.

San Jose, Ca, Us

In my role as a Project Manager for Intellectual Property (IP) projects, I was responsible for overseeing multiple concurrent projects, ensuring effective team coordination and successful project completion. My key responsibilities and achievements included: 1. Management of Design Schedules: Developed and managed design schedules for various IP projects in both Waterfall and Agile Methodologies. Crafted meticulous timelines and monitored progress to ensure adherence to deadlines, facilitating timely project delivery. 2. Program Reviews and Executive Reporting: Prepared and delivered comprehensive program reviews to the Executive Staff. Detailed project progress, key milestones, and addressed challenges or issues that arose during the project lifecycle. 3. Recruitment and Team Building: Managed the recruitment process as the hiring coordinator for the group. Ensured the selection of qualified candidates to bolster the team's capabilities and support ongoing projects. 4. Leadership of Cross-Functional Global Teams: Led diverse cross-functional teams from various global locations, including Japan, Colorado, California, Washington, Israel, and India. Navigated geographical and cultural differences through effective communication and coordination. 5. Oversight of Integrated Circuit Development Cycle: Oversaw the development of three integrated circuits, from the initial silicon phase to qualification and production. Ensured smooth transition through each project phase and successful completion.Overall, my role required a strategic blend of project management, team leadership, and stakeholder engagement. My contributions were key in driving the success of Intellectual Property projects, fostering international collaboration, and enhancing the organization's research and development efforts.

Starkville, Ms, Us

As a leader in electronics design, I was instrumental in spearheading customer support initiatives, collaborating on current generation designs, and driving the development of next-generation products. My key responsibilities and achievements included: 1. Leadership in Customer Support Initiatives: Spearheaded customer support initiatives, ensuring that user feedback and requirements were integral to the design and development process of the Quantus Tank Level Monitor. 2. Collaboration on Current Generation Designs: Worked closely with the Design team on the current generation of the Quantus Tank Level Monitor, incorporating innovative features and improvements based on customer insights and technological advancements. 3. Direction of PCB Design Team: Directed a design team in creating a Printed Circuit Board (PCB) set for the upcoming generation of unattended ground sensor. This included Antenna, RF, and Digital boards, demonstrating a comprehensive understanding of various electronic components. 4. Pioneering Next-Generation Mixed-Signal PCB Architecture: Pioneered a next-generation mixed-signal PCB architecture, successfully merging digital, mixed-signal, and RF circuits onto a singular PCB. Optimized circuit placement to eliminate sub-circuit interference, achieving a first-pass success in design and functionality. 5. Design of Various PCBs: Designed various Digital, RF, and mixed-signal Printed Circuit Boards, showcasing strong design acumen and expertise in electronics.Overall, my role required a blend of technical expertise, innovative thinking, and project management skills. My contributions were key in advancing the design and development of electronic products, ensuring high-quality, efficient, and cost-effective solutions.

San Jose, Ca, Us

Managed multiple design teams developing diverse I/O cells and libraries. Managed the tapeout of the second reticle set on a new 130nm SONOS technology. It contained many different die and preliminary IP from design teams around the world. Most complex reticle set at that time at Cypress. Project Lead of multiple dual port SRAMs. Physical design lead for 1Mb dual port SRAM. Part had 60 total metal/bond/package options. It leapfrogged the main competitor's offerings and back filled both Cypress' and the competitor's entire portfolio back to the existing 128k product.

Washington, Dc, Us