product engineering,product testing,quality management

1,Lead account manager for Hisilicon project in JCET Group , in charge of Hisilicon new products evaluation import served for 5 Test Factories (BGA, LGA&QFN Testing Plant, JCAP(JiangYin ChangDian Advanced Packaging Co.,LTD.), JSCC(STATSChipPAC Jiangyin Factory) ). The major work : engineering configuration, analysis loadboard \ socket \ Changekit drawing Risk, Test environment assessment, etc., import, progress tracking, as well as the correlation, LVM, NPI buyoff report review;2,Responsible for emerge customer business in BGA testing Plant (including customer related production requirements), new device import progress tracking, conversion technology and NPI conversion support;

1, During lead wafer test manager, responsible for production, equipment, process and quality management in wafer test-floor including production equipment scheduling, resource arrangement, communication and coordination between departments and customer, production line management, etc.;2, In charge of ZTE,RDA&SPRD clients such as product testing, including the correlation of new products, low yield analysis, abnormal data analysis, and assist customers to debug program, etc. ;HD HD3601 test program development use ADVANTEST 93K.Responsible for test program conversion , coding, program debug, gather correlation data, and release tracking .etc； 3, Design BGA testing production management system and engineering system architecture, system architecture update ,communication , system test , review status, plan next layer, training user and draft systems manual .

1, Develop test program like power management ,RF switch, RF power amplifier, CMMB decoding chip, USB/MSD/SIM module, MEMS etc., debugging ,customer maintenance. 2, Responsible for building first Wafer Test line in JCET , major work includes define wafer testing equipment specifications, equipment procurement, equipment move in and buyoff ,wafer test specifications and factory construction inspection and acceptance, wafer testing process, solve problems arising from the wafer testing process; wafer test program debugging, work with customer, ATE vendor &needle card vendor to solve various problems in wafer testing, assist customers for yield and process improvement;