Dirk Caspary Email & Phone Number

Bonn, North Rhine-Westphalia, Germany

Bonn Area, Germany

Ottawa, On, Canada

Analysis, assessment, and preparation of improvement proposals for patent applications, in particular under consideration of the competitive situation and of proving infringements.Analysis and assessment of patents and patent applications for the management of patent portfolio; for licensing; and in preparation of patent infringement, non-infringement, and invalidity arguments.Evidence-of-use documentation by means of reverse engineering and literature research.Patent Mining and Patent Landscape Analysis for competitive intelligence and freedom-to-operate analysis; mergers & acquisitions; prior art identification; and for predicting R&D and technology trends (IP Scouting). Development of customer-specific solutions like analysis methods, evaluation strategies, patent database queries, patent taxonomies, or reverse engineering techniques.IP product development and development of methods for the analysis, clustering, classification, and evaluation of patent portfolios using statistical methods including Natural Language Processing (NLP).Analysis and assessment of technologies i.e. of semiconductor technologies and processes.Initiator and technical lead of the Data Science Group at TechInsights.

Ottawa, On, Canada

Semiconductor process technology analysis and evaluation, including: materials analysis; process integration and mask count derivation; assessment of patents and patent applications; patent strengthening; preparation of documentations for patent infringement, non-infringement and invalidity arguments; prior art documentations; patent mining; patent landscape and portfolio analysis and evaluation; development of patent portfolio analysis methods; software development support.

Dresden, Germany

Responsible for plasma etch processes for structuring dielectric materials. Optimization of the unit process stability by statistical process control (SPC) and advanced process control (APC); yield improvement, and production throughput.Process development for 90 nm logic technologies and for power devices.Furthermore supporting other plasma etch unit process engineers to solve problems; failure mode and effect analysis (FMEA) moderation; and staff trainings.

Dresden, Germany

Unit process engineer for plasma etch processes. Responsible for deep trench (DT), high-aspect-ratio contact, self-aligned contact (SAC), spacer, and isotropic plasma etch processes. Responsible for improving existing processes with respect to manufacturing process stability, yield, and production performance. Staff trainings.Deep trench etch process development for the 90 nm DRAM technology.

Göttingen, Germany

Göttingen, Germany

Research Fellow for the collaborative research centres "Solids Far Away from Equilibrium" (SFB 345) and "Complex structures in condensed matter from atomic to mesoscopic scales" (SFB602).

Göttingen, Germany

Göttingen, Germany